Rotary cylindrical magnetron sputtering target

Abstract

The invention provides a rotary cylindrical magnetic control sputtering target, which comprises a pole terminal, permanent magnets, hollow cylindrical target material and a mandrel, wherein, the permanent magnets are embedded into the pole terminal along the axial direction of the cylindrical target material; the permanent magnets are long permanent magnetic strips and short permanent magnetic strips; positioning slots which are used for arrangement of the long permanent magnetic strips and the short permanent magnetic strips are arranged on the pole terminal; the long permanent magnetic strips and the short permanent magnetic strips are respectively arranged in corresponding positioning slots; a multipath bar magnet is formed by alternate distribution of the long permanent magnetic strips and the short permanent magnetic strips along the circumferential direction of the pole terminal; the polarity of the long permanent magnetic strips and that of the short permanent magnetic strips are different; the polarization direction is perpendicular to a central axis of a sputtering cathode; and closed racetrack shaped magnetic force lines are formed by magnetic rings on both ends of the pole terminal and the long permanent magnetic strips and the short permanent magnetic strips. The rotary cylindrical magnetic control sputtering target realizes low air pressure, high density and uniformity of discharge plasma, guarantees formation of a closed electronic racetrack under the condition of glow discharge, makes sputtering perform stably, has good surface quality of membranous layers and compact membranous layers, and is uniform in the consumption of the target materials and high in the utilization rate of the target materials.

Description

technical field [0001] The invention relates to a rotating cylindrical magnetron sputtering target for large-area coating, which is widely used in coating preparation equipment and belongs to the technical field of thin film preparation. Background technique [0002] At present, the magnetron sputtering equipment at home and abroad mainly has two types of sputtering source targets: coaxial magnetron sputtering target and planar magnetron sputtering target. The material is equipped with ring-shaped permanent magnets and pole shoes (magnetic pads). During sputtering, several ring-shaped glow discharge areas with gaps perpendicular to the target axis are formed. When plating large-area substrates (such as curtain walls) Glass) will inevitably form thick and thin stripes, resulting in serious uneven film thickness and affecting product quality. The planar magnetron sputtering target adopts a bar-shaped magnet structure, and a strip-shaped glow area parallel to the target axis i...

AI Technical Summary

Problems solved by technology

The ionization rate of argon gas is very low due to the short trajectory of the electrons, resulting in a low sputtering rate

Images