Method for plating copper on surface of carbon nanotube

A technology of carbon nanotubes and copper plating, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of long process route, difficult operation, high cost, etc., achieve simplified process, convenient operation, cheap effect

Inactive Publication Date: 2008-11-26
UNIV OF SCI & TECH LIAONING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The technology of copper plating on ordinary materials is relatively mature, but for nanomaterials, the technology of electroless copper plating is more complicated and difficult to operate
[0003] In the prior art, there have been applications of carbon

Method used

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  • Method for plating copper on surface of carbon nanotube
  • Method for plating copper on surface of carbon nanotube
  • Method for plating copper on surface of carbon nanotube

Examples

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Embodiment 1

[0044] The preparation method of copper plating on the surface of carbon nanotubes in this embodiment adopts Cu2+ as the source of elemental copper, and the reducing agent is Zn; its main reagents are CuSO4 5H2O, Zn powder, glycerol, ethylene glycol, potassium sodium tartrate, FeSO4 7H2O, HNO3; the concentration requirement of Cu2SO4·5H2O is 6.5g / l, the concentration requirement of glycerol is 133ml / l, the concentration requirement of ethylene glycol is 90ml / l, the concentration requirement of potassium sodium tartrate is 8.5g / l l, the concentration of FeSO4 7H2O is required to be 3.5g / l, the concentration of zinc powder is required to be 1.85g / l; the process conditions are as follows: the reaction time is 1 hour, the reaction temperature is 0-25°C, and the complexing agent is glycerol , ethylene glycol, and potassium sodium tartrate are used in combination, and the additive Fe2+ (FeSO4) is added to the plating solution;

[0045] The preparation method of the copper plating on...

Embodiment 2

[0049] The preparation method of copper plating on the surface of carbon nanotubes in this embodiment adopts Cu2+ as the source of elemental copper, and the reducing agent is Zn; its main reagents are CuSO4 5H2O, Zn powder, glycerol, ethylene glycol, potassium sodium tartrate, FeSO4 7H2O, HNO3; the concentration requirement of Cu2SO4·5H2O is 6.0g / l, the concentration requirement of glycerol is 125ml / l, the concentration requirement of ethylene glycol is 85ml / l, the concentration requirement of potassium sodium tartrate is 8.0g / l l, the concentration of FeSO4 7H2O is required to be 3.0g / l, and the concentration of zinc powder is required to be 1.80g / l; the process conditions are as follows: the reaction time is 50 minutes, the reaction temperature is 0-25°C, and the complexing agent is glycerin, Ethylene glycol and potassium sodium tartrate are used in combination, and the additive Fe2+ (FeSO4) is added to the plating solution;

[0050] The preparation method of the copper plat...

Embodiment 3

[0054] The preparation method of copper plating on the surface of carbon nanotubes in this embodiment adopts Cu2+ as the source of elemental copper, and the reducing agent is Zn; its main reagents are CuSO4 5H2O, Zn powder, glycerol, ethylene glycol, potassium sodium tartrate, FeSO4 ·7H2O, HNO3; the concentration requirement of Cu2SO4·5H2O is 7.0g / l, the concentration requirement of glycerol is 140ml / l, the concentration requirement of ethylene glycol is 95ml / l, the concentration requirement of potassium sodium tartrate is 9.0g / l l, the concentration of FeSO4 7H2O is required to be 4.0g / l, and the concentration of zinc powder is required to be 1.90g / l; the process conditions are as follows: the reaction time is 70 minutes, the reaction temperature is 0-25°C, and the complexing agent is glycerin, Ethylene glycol and potassium sodium tartrate are used in combination, and the additive Fe2+ (FeSO4) is added to the plating solution;

[0055] The preparation method of the copper pla...

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Abstract

The invention discloses a preparation method for plating copper on the surface of a carbon nano-tube, which is characterized by adopting Cu2+ as the source of the elementary substance copper and adopting Zn or HCHO as a reducing agent. When adopting Zn as the reducing agent, the main reagents are: CuSO4.5H2O, Zn powder, glycerol, glycol, potassium sodium tartrate, FeSO4.7H2O and HNO3. When adopting the HCHO as the reducing agent, the main reagents are: CuSO4.5H2O, HCHO, EDTANa2, FeCl3.7H2O, triethanolamine, a, a-bipyridine, NaOH and HNO3. The technological process of the plating copper on the surface of the carbon nano-tube is as follows: carbon nano-tube oxidation, water scrubbing, plating, water scrubbing and drying. The preparation method of the plating copper on the surface of the carbon nano-tube of the invention not only changes the traditional way of palladium catalysis but also has the advantages of low price and convenient operation, which simplifies process and is simple.

Description

technical field [0001] The invention relates to the technology of electroless copper plating on the surface of nanometer materials, and in particular provides a method for preparing copper plating on the surface of nanometer carbon tubes. Background technique [0002] Carbon nanotubes are the most characteristic new class of one-dimensional nano functional materials discovered in the early 1990s. Their unique structures can be used to prepare nanocomposites filled with metal or metal oxides. In order to give full play to the unique functions of carbon nanotubes, relevant scholars have turned their attention to modification and surface modification, forming new hotspots and cutting-edge research topics; coating carbon nanotubes with different materials can obtain one-dimensional carbon nanotubes with special properties. nanocomposites. The technology of copper plating on ordinary materials is relatively mature, but for nanomaterials, the technology of electroless copper plat...

Claims

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Application Information

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IPC IPC(8): C23C18/40
Inventor 李红霞高丽新程路凡
Owner UNIV OF SCI & TECH LIAONING
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