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Fixed abrasive polishing pad with self-finishing function and even wear

A technology of fixed abrasives and uniformity, applied in grinding/polishing equipment, abrasives, machine tools for surface polishing, etc. Uniformity and other issues to achieve the effect of reducing production costs, improving production efficiency, and improving surface accuracy

Active Publication Date: 2008-12-24
ECO POWER WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the invention is to aim at in the process of (chemical) mechanical polishing, when polishing pad polishes workpiece, workpiece also produces abrasion to polishing pad, and the wearing and tearing of polishing pad along its radial direction is non-uniform, makes The surface accuracy of the polishing pad cannot be well maintained, which affects the processing accuracy and the life of the polishing pad. Design a fixed abrasive polishing pad with self-dressing function and good wear uniformity.

Method used

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  • Fixed abrasive polishing pad with self-finishing function and even wear
  • Fixed abrasive polishing pad with self-finishing function and even wear
  • Fixed abrasive polishing pad with self-finishing function and even wear

Examples

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Effect test

example 1

[0032] The surface pattern optimization process of the uniformly worn consolidated abrasive polishing pad with self-conditioning function of the present invention is:

[0033] First of all, the process designer selects the appropriate polishing pad structural parameters from the product requirements, mainly the inner diameter and outer diameter of the polishing pad; in this example, the inner diameter of the polishing pad is 200mm, and the outer diameter is 900mm. Those skilled in the art can realize the polishing pad of diameter by analogy.

[0034] Second, establish the wear model of the polishing pad, according to figure 1 The wear trajectory of the polishing pad shown in the figure uses MATLAB software to simulate the wear of the polishing pad to obtain the wear of the polishing pad at various points along its radial direction, and draw the change diagram of the polishing pad's wear along the radial direction, as figure 2 shown;

[0035] The 3rd, utilize the wear and te...

example 2

[0042] The surface pattern optimization process of the uniformly worn consolidated abrasive polishing pad with self-conditioning function of the present invention is:

[0043] First, the process designer selects the appropriate polishing pad structural parameters from the product requirements, mainly the inner diameter and outer diameter of the polishing pad; in this example, the inner diameter of the polishing pad is 150mm, and the outer diameter is 600mm.

[0044] Secondly, the wear model of the polishing pad is established, and the change diagram of the wear of the polishing pad along the radial direction is drawn;

[0045] Third, use the change diagram of the wear of the polishing pad along the radial direction to divide the polishing pad into three annular areas. In this example, the width of the I zone is 80mm, the width of the II zone is 50mm, and the width of the III zone is 95mm;

[0046] Fourth, in the divided area, combined with the change diagram of the wear of the...

example 3

[0052] The surface pattern optimization process of the uniformly worn consolidated abrasive polishing pad with self-conditioning function of the present invention is:

[0053] First, the process designer selects the appropriate polishing pad structure parameters from the product requirements. In this example, the inner diameter of the polishing pad is 200mm, and the outer diameter is 1000mm;

[0054] Secondly, the wear model of the polishing pad is established, and the change diagram of the wear of the polishing pad along the radial direction is drawn;

[0055] Third, use the change diagram of the wear of the polishing pad along the radial direction to divide the polishing pad into three annular areas. In this example, the width of the I zone is 115mm, the width of the II zone is 85mm, and the width of the III zone is 200mm;

[0056] Fourth, in the divided area, combined with the change diagram of the wear of the polishing pad along the radial direction, the density ratio is ...

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Abstract

The present invention relates to a bonded abrasive polishing mat with a self-dressing function and good abrasion uniformity. Three annular areas with different densities are arranged on the working surface of the polishing mat; the width ratio of the three annular areas from inside out is 8 to 18:10:20 to 30; the density ratio of the abrasives corresponding to the three annular areas is 0.55 to 0.85:1:0.50 to 0.70. The polishing mat can ensure that the precision of the surface shape of the polishing mat can be maintained for a long time in the process of polishing, thus improving the precision of the surface shape of a workpiece, which is significant for the machining of silicon wafers, hard disk substrates and optical components, and moreover, the polishing mat can avoid the trouble of repetitively dressing the polishing mat, thus greatly increasing working efficiency and reducing production cost.

Description

technical field [0001] The invention relates to a fixed abrasive (chemical) mechanical polishing pad, especially a fixed abrasive polishing pad with an optimized surface design, in particular to a polishing pad with a self-conditioning function that enables the polishing pad to wear evenly during the polishing process Fixed abrasive polishing pad with good wear uniformity. Background technique [0002] As we all know, (chemical) mechanical polishing (CMP) technology is one of the key technologies for semiconductor wafer surface processing, and is used for surface planarization at various stages of the integrated circuit manufacturing process. CMP can be said to be the only means of global planarization in chip manufacturing. [0003] In recent years, with the rapid development of high-tech technologies such as the Internet and mobile communications, the demand for semiconductors has also increased, and the use of CMP in processing has become more and more demanding. Accord...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D13/14B24B37/04B24B29/00H01L21/304B24B37/20
Inventor 朱永伟左敦稳李茂李军周亮王军康静
Owner ECO POWER WUXI
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