Device for controlling photo-etching machine immerge

Abstract

The invention discloses an immersion control device used for a photoetching machine; a circular flow field cushion chamber, a sealing structure and a drying cavity are arranged from an injection cavity and a recovery cavity outwards in sequence; the flow field cushion chamber can carry out compensation to an exposure flow field in real time so as to reduce the occurrence probability and intensity of liquid backflow; the sealing structure adopts a combination mode of surface characteristic processing of hydrophilic and hydrophobic and the structure design of a tension groove; the section of the tension groove is a triangle inclined outwards in the direction vertical to a substrate; liquid which is drawn to move by the substrate forms backflow so as to restrain the liquid leakage; the drying cavity is filled with matters with super absorbent and communicated with negative pressure, and discharges possible residue of droplets in real time; simultaneously, the mode of conveying the liquid adopts positive pressure to feed the liquid and free flowing of recovery side, thus avoiding fluctuation of flow field caused by the incoordination of liquid injection and recovery pressure.

Description

technical field [0001] The invention relates to an immersion control device for a photolithography machine. Background technique [0002] Modern lithography equipment is based on optical lithography, which uses an optical system to accurately project and expose patterns on a mask onto a photoresist-coated substrate (such as a silicon wafer). It includes a laser light source, an optical system, a projection mask composed of chip patterns, an alignment system and a substrate covered with photosensitive photoresist. [0003] The immersion lithography system fills a certain liquid in the gap between the projection lens and the substrate, and increases the numerical aperture (NA) of the projection lens by increasing the refractive index (n) of the medium in the gap, thereby improving the resolution of lithography. rate and depth of focus. [0004] It has been proposed to fill the gap between the end element of the projection device and the substrate by completely immersing the ...

AI Technical Summary

Problems solved by technology

Liquid recirculation will increase the temperature of the liquid during the exposure process and the accumulation of pollutants (such as PAG components in the photoresist), and the vortex in the flow field will also cause the tiny bubbles contained in the liquid to aggregate into large bubbles. When projecting through the recirculation area, it will cause aberration and affect the exposure image quality

[0009] (3) During the high-speed scanning movement of the substrate, the surrounding air may be entrained into the flow field, forming bubbles, causing light to scatter during the exposure process, and affecting the imaging quality;

During the high-speed movement of the substrate, once the external air or sealing liquid is involved or dissolved or diffused into the filling liquid, it will have a negative impact on the exposure quality

Images