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Water gas treatment device

A waste gas treatment device and waste gas technology are applied in the direction of climate sustainability, greenhouse gas capture, perfluorocarbon/hydrofluorocarbon capture, etc., which can solve the difficulties of semiconductor production efficiency reduction, cost and installation space constraints, etc. problem, to achieve the effect of preventing warming and excellent temperature correction correspondence ability

Inactive Publication Date: 2008-12-31
NISSEI SANGYO
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0006] Therefore, if the amount of exhaust gas introduced into the device is limited, there is a danger that the production efficiency of semiconductors will decrease.
On the other hand, installing multiple exhaust gas treatment devices has many difficulties in terms of cost and installation space constraints

Method used

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Embodiment Construction

[0044] Hereinafter, the best mode for carrying out the present invention will be described based on the drawings.

[0045] The exhaust gas treatment device 10 according to the embodiment of the present invention, such as figure 1 It includes an exhaust gas introduction part 12, a heat treatment part 14, a water treatment part 16, and a final treatment part 18, and has a width and depth of about 1 m and a height of about 2 m.

[0046] In the embodiment of the present invention, the waste gas introduction part 12 is provided with a circulation line of waste gas including toxic gas and warming effect gas such as PFC discharged in the semiconductor manufacturing process. In addition, the heat treatment part 14 is a part which heats exhaust gas. In addition, the water treatment part 16 is a part which cools the powder and gas produced|generated by heat-processing exhaust gas, and performs any one or all of hydrolysis, gas-liquid separation, and powder separation. In addition, the...

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Abstract

The invention provides a waste gas treating apparatus for effectively executing heat treatment for waste gas containing warm gas. The waste gas is introduced from a waste gas introducing section (12) into a heating treatment section (14). The waste gas is pyrolyzed mainly by radiation heat heated with an electromagnetic induction heating unit (22) and coming from a circular cylinder tube (20), in process of one-way pass from its base end section to end section in a circular cylinder tube of the heating treatment section. At this time, heating time for waste gas is adequately secured because waste gas becomes rotational flow via a commutation unit (24) to pass through the circular cylinder tube (20). As a result, even in condition that introduced waste gas from the waste gas introducing section (12) rapidly increases, desired capacity of decomposition is secured. In addition, power and gas generated by heating waste gas is cooled and decomposed in a water treating section (16) to remove residual mist in a final treating section (18).

Description

technical field [0001] The present invention relates to a waste gas treatment device capable of detoxification and decomposition treatment by heat-treating waste gas containing warming effect gases such as poisonous gas and PFC discharged in a semiconductor manufacturing process. Background technique [0002] As a part of the countermeasures against global warming, even in the electronic equipment manufacturing industry, the detoxification and decomposition of poisonous gas / PFC and other warming effect gases discharged from the semiconductor manufacturing process have become unavoidable issues. In recent years, various devices for treating exhaust gas have been developed. [0003] Generally, the waste gas device is a pyrolysis treatment device, and an electric heater is used as the heating unit of the waste gas. Compared with combustion methods that require propane gas or oxygen, etc., electric heaters can only use electricity and cooling water for installed equipment, whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01D53/75
CPCY02C20/30Y02P70/50B01D53/24B01D53/26
Inventor 芳贺裕
Owner NISSEI SANGYO
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