Preparation process of rare-earth copper alloy material for preparing integral dispersion copper

Abstract

The invention belongs to the technical field of alloy material. The proposed rare earth Cu-Al alloy materials used for preparing integral dispersion copper mainly comprise Cu, Al and rare earth additive RE; wherein, the contents of each component are: 0.10wt percent to 1.00wt percent of Al; 0.05wt percent to 0.50 wt percent of RE and the rest is Cu; the rare earth additive RE relates to Y or Ce or mixed rare earth element (Ce +Y); the mixed rare earth element (Ce +Y) adopts pure rare earth to weigh and carry out mixing; the mixture ratio thereof is: wt percent of Ce: wt percent of Y is equal to 1:1; the preparation technique of the rare earth Cu-alloy material includes the smelting of the alloy; the thermal processing of the alloy; the solid dissolving of the alloy; the cold processing and shaping after the solid dissolving; wherein, the processing temperature of the solid dissolving of the alloy is 900 to 950 DEG C; water quenching is carried out after preserving the temperature for 2 to 4h; then thermal squeezing or hot rolling process is carried out for 4h to 8h under the temperature of 850 to 950 DEG C. The dispersion copper prepared by the invention has the characteristics of high intensity, high conductance, high anti-softening temperature; the preparation method thereof has the advantages of short internal oxidation time, low cost and high efficiency.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, and mainly relates to a preparation process method of a rare-earth copper-aluminum alloy material for integrally dispersed copper preparation. The dispersed copper materials prepared by using it can be used in high-power electric vacuum tubes, microelectronic device pins, integrated circuit lead frames, microwave communications, power transmission and other fields, and are widely used in national defense industry and electronic information industry. Background technique [0002] High-strength and high-conductivity copper-based composites are a new type of functional material with excellent comprehensive properties. They not only have excellent electrical conductivity, but also have high strength and superior high-temperature performance. With the development of the electronics industry, especially in the late 1970s, the American SCM company developed the Glidcop series Al 2 o 3 After di...

AI Technical Summary

Problems solved by technology

This is the same as Al 2 o 3 The particle size of the powder is larger (m