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Preparation process of rare-earth copper alloy material for preparing integral dispersion copper

A technology of alloy material and preparation process, which is applied in the preparation field of rare earth copper-aluminum alloy material for the preparation of integral dispersed copper, can solve the problems of large particle size of powder and low dispersion strengthening effect, and achieves low cost, high conductivity and high resistance. The effect of softening temperature

Inactive Publication Date: 2009-01-07
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is the same as Al 2 o 3 The particle size of the powder is larger (micron scale), and the effect of dispersion strengthening is relatively low.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The copper alloy material in this embodiment mainly contains Cu, Al and rare earth additive Y, wherein the content of each component is: Al, 0.45wt%; Y, 0.05wt%; the balance is Cu.

[0024] The process for preparing the above-mentioned copper alloy material includes:

[0025] ①Smelting of alloys; ②Hot processing of alloys; ③Solid solution of alloys; ④Cold working deformation after solid solution.

[0026] Wherein: the melting of the alloy is a vacuum intermediate frequency induction melting process, that is, the melting of the alloy is smelted in a ZG-0.2 type 200kg vacuum intermediate frequency induction melting furnace (with a graphite crucible). After melting the high-purity cathode copper (purity 99.95%), the temperature is raised and refined for 10 minutes, and then Al is added for heat preservation and smelting. Under the protection of Ar gas, Y was added, fully stirred, then cast, cooled for about 15 minutes, and then released from the furnace. The casting temp...

Embodiment 2

[0031] The copper alloy material in this embodiment mainly contains Cu, Al and rare earth additive Ce, wherein the content of each component is: Al, 0.15wt%; Ce, 0.50wt%; the balance is Cu.

[0032] The process for preparing the above-mentioned copper alloy material includes:

[0033] ①Smelting of alloys; ②Hot processing of alloys; ③Solid solution of alloys; ④Cold working deformation after solid solution.

[0034] Wherein: the smelting and forging of the alloy is a medium-frequency induction melting process under a traditional atmospheric environment, that is, the melting of the alloy is smelted in a 1000kg medium-frequency induction melting furnace (using a graphite crucible). After melting high-purity cathode copper (purity 99.95%), charcoal powder is covered to prevent oxidation, then the temperature is raised and refined for 8 minutes, and Al is added for heat preservation and smelting. Add Ce (considering the amount of burning loss), fully stir and then cast, cool for abou...

Embodiment 3

[0039] The copper alloy material of this embodiment mainly contains Cu, Al and rare earth additives (Ce+Y), wherein the content of each component is: Al, 0.95wt%; (Ce+Y), 0.35wt%; the balance is Cu.

[0040] The process for preparing the above-mentioned copper alloy material includes:

[0041] ①Smelting of alloys; ②Hot processing of alloys; ③Solid solution of alloys; ④Cold working deformation after solid solution.

[0042] Wherein: the melting of the alloy is a power frequency induction melting process, that is, the melting of the alloy is smelted in a 3000kg power frequency induction melting furnace. After melting the high-purity cathode copper (purity 99.95%), the temperature is raised and refined for 10 minutes, and then Al is added for heat preservation and smelting. Under the protection of Ar gas, add (Ce+Y), fully stir and then cast, cool for about 15 minutes and then come out of the furnace. The casting temperature is about 1350°C, and the diameter of the cast ingot i...

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Abstract

The invention belongs to the technical field of alloy material. The proposed rare earth Cu-Al alloy materials used for preparing integral dispersion copper mainly comprise Cu, Al and rare earth additive RE; wherein, the contents of each component are: 0.10wt percent to 1.00wt percent of Al; 0.05wt percent to 0.50 wt percent of RE and the rest is Cu; the rare earth additive RE relates to Y or Ce or mixed rare earth element (Ce +Y); the mixed rare earth element (Ce +Y) adopts pure rare earth to weigh and carry out mixing; the mixture ratio thereof is: wt percent of Ce: wt percent of Y is equal to 1:1; the preparation technique of the rare earth Cu-alloy material includes the smelting of the alloy; the thermal processing of the alloy; the solid dissolving of the alloy; the cold processing and shaping after the solid dissolving; wherein, the processing temperature of the solid dissolving of the alloy is 900 to 950 DEG C; water quenching is carried out after preserving the temperature for 2 to 4h; then thermal squeezing or hot rolling process is carried out for 4h to 8h under the temperature of 850 to 950 DEG C. The dispersion copper prepared by the invention has the characteristics of high intensity, high conductance, high anti-softening temperature; the preparation method thereof has the advantages of short internal oxidation time, low cost and high efficiency.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, and mainly relates to a preparation process method of a rare-earth copper-aluminum alloy material for integrally dispersed copper preparation. The dispersed copper materials prepared by using it can be used in high-power electric vacuum tubes, microelectronic device pins, integrated circuit lead frames, microwave communications, power transmission and other fields, and are widely used in national defense industry and electronic information industry. Background technique [0002] High-strength and high-conductivity copper-based composites are a new type of functional material with excellent comprehensive properties. They not only have excellent electrical conductivity, but also have high strength and superior high-temperature performance. With the development of the electronics industry, especially in the late 1970s, the American SCM company developed the Glidcop series Al 2 o 3 After di...

Claims

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Application Information

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IPC IPC(8): C22C9/01C22F1/08
Inventor 田保红刘平刘勇宋克兴贾淑果任凤章李红霞张毅陈小红
Owner HENAN UNIV OF SCI & TECH
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