MEMS encapsulation method

Abstract

The invention discloses an MEMS sealing and packaging method which comprises the following steps: a micro seal cover structure which is provided with a bottom opening and matched with an MEMS device is etched on a glass sheet or a silicon slice; a groove is etched on the bottom end of the wall body of the micro seal cover; the MEMS device and an electrode thereof are arranged on a substrate; an isolation layer is arranged at a bonding sealing area of the substrate around the MEMS device; a filler is arranged on the isolation layer or in the groove at the bottom end of the micro seal cover; the micro seal cover is bonded with the substrate; the groove at the bottom end of the micro seal cover is positioned on the isolation layer to form a stuffed seal cavity; the filler is positioned in the stuffed seal cavity and heated till the filler is melted, thus that the micro seal cover seals MEMS device is realized. The method can reserve the plane wire leading technology, is suitable for integrated manufacturing, and can improve the sealing strength and performance.

Description

technical field [0001] The invention relates to the preparation technology of MEMS, in particular to a MEMS sealing and packaging method. Background technique [0002] Microelectromechanical systems (MEMS for short) technology developed on the basis of microelectronics technology is an emerging multidisciplinary high-tech field, and the corresponding MEMS device products will play an increasingly important role in the national economy and national security. important role. For MEMS micro-devices, both the structural size and the air gap are very small, usually on the order of microns. At this time, even ordinary moisture, dust and other tiny particles in the environment may be fatal to MEMS devices, so hermetic packaging is often required. It provides guarantees for its stable work, high reliability, small drift and resistance to various harsh environments. Most MEMS devices include movable mechanical structures, and some MEMS devices work in a resonant state, and air damp...

AI Technical Summary

Problems solved by technology

Although this method makes up for the lack of sealing performance caused by the unevenness of the wiring and the silicon surface, its polysilicon lead resistance is relatively high, and it can only be used on Si substrates, and severely limits the thickness of the device structure.

Another improved method is to change the plane lead in the body processing packaging process to the through-hole lead on the back of the substrate. This method is complicated, reduces the strength of the package structure, and increases the parasitic effect

[0006] In short, the existing MEMS hermetic packaging technology is still very immature, and its sealing performance is far from meeting the application needs of MEMS devices. It needs to be improved in terms of integrated manufacturability, package structure strength and endurance, process complexity and cost.

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