Cu-P based amorphous brazing filler metal and method for manufacturing the same

A brazing filler metal and amorphous technology, applied in the field of amorphous brazing filler metal and copper and copper alloy brazing, can solve the problems of reducing joint strength and achieve the effect of narrow melting range and good toughness

Inactive Publication Date: 2009-02-18
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1. Component formula:

[0034] The composition and content of the brazing filler metal are: P: 7.6%, Ni: 14.0%, Sn: 5.0%, Zr: 0.04%, Si: 0.2%, and the rest is Cu. The sum of the mass percentages of each component is 100 %.

[0035] 2. Preparation method:

[0036] 1. Formula: crush the raw materials of zirconium, copper, tin, nickel and copper-silicon, copper-phosphorus master alloy, and make the ratio;

[0037] 2. Loading: Put the above ingredients in the electric arc furnace, 5 copper crucibles in the electric arc furnace, put a piece of pure Ti sample in one of the crucibles, and put four kinds of the same formula or different formulas in the other four crucibles at the same time. Ingredients;

[0038] 3. Vacuuming: first vacuumize the furnace to 10 -2 Pa, after flushing the furnace with argon for 3-4 times, then evacuate to 10 -2 Pa, filled with argon to -0.06MPa;

[0039] 4. Deoxygenation: Melt a piece of pure Ti sample put into the crucible for 3-4 times to r...

Embodiment 2

[0048] 1. Component formula:

[0049] The composition and content of the brazing material are: P: 7.0%, Ni: 14%, Sn: 5.0%, Zr: 0.06%, Si: 0.2%, and the rest is Cu. The sum of the mass percentages of each component is 100 %.

[0050] Two, preparation method: same as embodiment 1 preparation method.

[0051] The melting temperature range of the prepared amorphous solder is 593-635° C., and the joint shear strength of the flame brazed red copper is 102 MPa.

Embodiment 3

[0053] 1. Component formula:

[0054] The components and contents of solder are: P: 8.0%, Ni: 14%, Sn: 5.0%, Zr: 0.02%, Si: 0.2%, and the rest is Cu. The sum of the mass percentages of each component is 100% %.

[0055] Two, preparation method: same as embodiment 1 preparation method.

[0056] The melting temperature range of the prepared amorphous solder is 590-634° C., and the joint shear strength of the flame brazed red copper is 92 MPa.

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Abstract

The invention relates to the technical field of the brazing of amorphous filler metal, copper and copper alloy, and relates to Cu-P based amorphous filler metal and a preparation method thereof. The Cu-P based amorphous filler metal comprises the following compositions with the content in percentage by mass: 7.0 to 8.0 percent of P, 14.0 percent of Ni, 5.0 percent of Sn, 0.02 to 0.06 percent of Zr, 0.2 percent of Si, and the balance being Cu. The preparation of the Cu-P based amorphous filler metal adopts a fast solidification technology, and the prepared filler metal has bright and clean surface, smooth two sides, and good toughness. The melting temperature range of the filler metal is between 590 and 635 DEG C, and the temperature of the brazing is between 650 and 685 DEG C. The filler metal is applicable to the brazing of the copper and the copper alloy, and applicable brazing techniques comprise flame brazing, furnace brazing, gas-shielded brazing, salt bath brazing and the like. When the filler metal is adopted to perform the flame brazing to red copper, the wettability of the filler metal is apparently better than that of filler metals which has the same compositions and are prepared by the prior melting technology, and the shearing strength of a brazed joint is larger than 92MPa, so the filler metal has good application prospect.

Description

technical field [0001] The invention relates to a Cu-P-based amorphous solder and a preparation method thereof, in particular to a zirconium-containing Cu-P-Sn-Ni-Si amorphous solder for brazing copper and copper alloys and a preparation method thereof, belonging to the amorphous The technical field of brazing filler metal and copper and copper alloy brazing. Background technique [0002] Silver-based solder has a moderate melting point, good manufacturability, and good strength, toughness, electrical conductivity, thermal conductivity, and corrosion resistance. It is widely used in various fields of modern industry, such as electronics, home appliances, aerospace, energy, and automobile manufacturing. widely used. With the development of science and technology and the progress of society, the demand for silver-based solder is also increasing. In my country, the consumption of silver for making silver-based solder reaches more than 1,000 tons every year. But silver is a pr...

Claims

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Application Information

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IPC IPC(8): B23K35/30C22C1/03
Inventor 邹家生王超赵其章吕思聪
Owner JIANGSU UNIV OF SCI & TECH
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