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Process for producing low-molecular polyphenylene ether

一种低分子量、制造方法的技术，应用在环氧树脂组合物,电子部件领域，能够解决聚苯醚与环氧树脂相容性差等问题，达到溶解性良好、处理性优异的效果

Inactive Publication Date: 2009-03-18
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Further, in general, polyphenylene ethers are poorly compatible with epoxy resins

Method used

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  • Process for producing low-molecular polyphenylene ether
  • Process for producing low-molecular polyphenylene ether

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～3

[0140] The redistribution reaction was carried out using the compounding conditions and reaction conditions shown in Table 1 to obtain low molecular weight polyphenylene ethers I to XI. Table 1 also shows the analysis results of the obtained low-molecular-weight polyphenylene ether. In addition, detailed reaction conditions are as follows.

Embodiment 1

[0142] 300 g of mesitylene was added as a solvent in a reactor with a bottom plug valve, and after heating to 90° C., 100 g of raw material polyphenylene ether (manufactured by Asahi Kasei Chemical Co., Ltd., trade name: S202A) with a number average molecular weight of 18,000 was dissolved. And 6 g of bisphenol A (BPA) as a polyphenolic compound. To this was added 60 g of a 10% mesitylene solution of benzoyl peroxide (BPO) (manufactured by NOF Corporation, trade name: NYPER BMT) over 240 minutes, and stirred at 90°C for 60 minutes to perform a redistribution reaction. The decomposition rate constant of the radical initiator at this time was 0.55, and the critical value obtained by dividing the decomposition rate constant by the addition time was 0.14 (1 / hr).

[0143] After adding an aqueous sodium bicarbonate solution to this reaction solution to sufficiently wash (alkaline washing), only the aqueous solution was removed. A small amount of the organic layer at this time was t...

Embodiment 2

[0145] 300 g of xylene was added as a solvent in a reactor with a bottom plug valve, and after heating to 90° C., 100 g of raw material polyphenylene ether (manufactured by Asahi Kasei Chemical Co., Ltd., trade name: S201A) with a number average molecular weight of 20,000 and 8 g of bisphenol were dissolved. Phenol A (BPA) is a polyphenolic compound. To this, 400 g of a 2.5% xylene solution of benzoyl peroxide (BPO) (manufactured by NOF Corporation, trade name: NYPER BMT) was added over 120 minutes, and reacted at 90° C. for 120 minutes. The decomposition rate constant of the radical initiator at this time was 0.55, and the critical value of dividing the decomposition rate constant by the dropping time was 0.28 (1 / hr).

[0146] After adding an aqueous sodium bicarbonate solution to this reaction solution to sufficiently wash (alkaline washing), only the aqueous solution was removed. A small amount of the organic layer at this time was taken out, and the number average molecul...

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Abstract

The invention provides a process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass% or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether: solvent)(mass ratio) is provided at 0.4 : 100 to 40 : 100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator: solvent) (mass ratio) is provided at 0.5 : 100 to 5 : 100 (mass ratio).

Description

technical field [0001] The present invention relates to a method for producing low-molecular-weight polyphenylene ether, a low-molecular-weight polyphenylene ether, a method for producing epoxidized polyphenylene ether, an epoxy resin composition, and an electronic component. Background technique [0002] Epoxy resins with excellent cost performance are widely used as insulating materials for printed circuit boards. In addition, in recent years, in order to cope with the increase in the density of circuits, etc., the higher functionalization of the physical properties of epoxy resins has been pursued. For example, for printed circuit boards used in high-frequency fields such as satellite communications, insulating materials having excellent dielectric properties such as low dielectric constant and low dielectric loss tangent are required from the viewpoint of preventing signal delay. [0003] As one of materials having excellent dielectric properties, polyphenylene ether ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08G59/62C08J5/24
CPCC08G65/44C08G59/621C08G65/46C08J2363/00C08J5/24C08J5/244C08J5/249
Inventor 鬼贤三樱井稔
Owner ASAHI KASEI KK
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