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Technique for preparing ultramicro enamelling cuprum round line

A production process, enamelled copper technology, applied in the direction of metal/alloy conductors, electrical components, circuits, etc., can solve the problems of high breakage rate of enamelled copper round wire, low wire drawing breakage rate, and decrease in tensile strength. To achieve the effect of reducing the rate of enamelled wire breakage, reducing the rate of wire drawing wire breakage, and improving the tensile strength

Active Publication Date: 2009-04-22
ROSHOW TECH
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly provides a method that can realize the total deformation compression rate of the copper wire before enamelling without annealing not exceeding 80%, thereby realizing the reduction of microcracks in the wire drawing copper wire, uniform annealing composition, less wire breaking rate in wire drawing, and ultra-fine wire The production process of ultra-fine enamelled round copper wire with increased tensile strength; solving the technical problems of high disconnection rate and decreased tensile strength of enamelled round copper wire existing in the prior art

Method used

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  • Technique for preparing ultramicro enamelling cuprum round line
  • Technique for preparing ultramicro enamelling cuprum round line
  • Technique for preparing ultramicro enamelling cuprum round line

Examples

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Effect test

Embodiment 1

[0026] Such as figure 1 As shown, a production process of ultra-fine enamelled copper round wire, firstly, ultra-pure cathode copper is selected by ultra-fine wire drawing and screening method, and the components of ultra-pure cathode copper include, by weight percentage: the content of copper is 99.99% , the content of oxygen is 0.003%, the content of sulfur is 0.0004%, the content of phosphorus is 0.0002%, the content of silicon is 0.0003%, the content of iron is 0.0005%, the content of zinc is 0.0001%, the content of gold is 0.001%, The content of silver is 0.001%, and the rest are impurities.

[0027] The selected copper wire is drawn, and the drawing process includes a middle drawing step, a small drawing step and a micro drawing step in sequence. Among them, the diameter of the incoming wire in the middle drawing step is 1.0mm, and the middle drawing is 0.3mm, and then the middle drawing annealing and the middle drawing take-up are carried out; then enter the small draw...

Embodiment 2

[0031] Such as figure 1 As shown, a production process of ultra-fine enamelled copper round wire, in the wire drawing process, includes a medium drawing step, a small drawing step, a micro drawing step and an ultra micro drawing step. The annealing voltage in the small drawing step is 19V, the production speed is 1200m / min, and the relative annealing degree is 55.92%; the annealing temperature in the micro-drawing step is 480°C, the production speed is 600m / min, and the relative annealing degree is 99%; The annealing temperature in the micro-drawing step is 450° C., the production speed is 600 m / min, and the relative annealing degree is 94.16%. All the other are the same with embodiment 1. According to the relevant performance parameters of the 0.06mm enameled wire produced by the above process, it is obtained through testing: the average elongation at break is 23.88%, and the average tensile strength is 263.10N / mm 2 , the average resistivity at 20°C is 0.01651Ω / mm 2 .m. A...

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Abstract

The invention relates to a processing technology of an electromagnetic wire, in particular to a production process of an ultra-micro enameled copper round wire. The production process comprises a wire drawing procedure, an insulating layer coating procedure and an enameling procedure; in the wire drawing procedure, the copper wire goes through an intermediate drawing procedure, a small drawing procedure, a micro-drawing procedure and an ultra-micro drawing procedure, and an annealing technique is carried out in the micro-drawing procedure and the ultra-micro drawing procedure. The invention mainly provides the production process of the ultra-micro enameled copper round wire which can realize that the total unannealed deformation compression ratio of the copper wire is not more than 80% before enameling to further realize less micro-cracks of the drawn copper wire, even annealing components, lower wire drawing breakage and higher tensile strength of the ultra-micro fine wire. The process helps solve the technical problems of high breakage and low tensile strength of the enameled copper round wire in the prior art.

Description

technical field [0001] The invention relates to a processing technology of an electromagnetic wire, in particular to a production technology of an ultrafine enamelled round copper wire. Background technique [0002] Ultra-fine enameled wire is a branch of electromagnetic wire belonging to the wire and cable industry. It is a functional material that converts electrical energy into mechanical energy or converts mechanical energy into electrical energy. Usually, the enamelled copper round wire with a nominal wire diameter of 0.07mm-0.099mm is called a micro enameled wire, while the nominal wire diameter below 0.06mm is called an ultra-fine enameled wire. Ultra-fine enamelled round copper wire is widely used in household appliances, microelectronics, and IT products, such as micro-motors, relays, small transformers, inductors, oscillating coils, audio coils, magnetic heads, automotive ignition coils, etc. The conductor of the enamelled copper round wire uses industrial pure co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B1/02
Inventor 鲁永吴少英方浩斌应江辉
Owner ROSHOW TECH
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