Tin electroplating bath, tin-plated coating film, tin electroplating method, and electronic device component

一种锡电、锡盐的技术，应用在电子器件元件领域，能够解决可焊性降低等问题，达到容易控制、高可加工性的效果

Inactive Publication Date: 2009-04-29
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, heat treatment and reflow treatment cause an oxide film to form on the tin-plated film, resulting in a decrease in solderability

Method used

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  • Tin electroplating bath, tin-plated coating film, tin electroplating method, and electronic device component
  • Tin electroplating bath, tin-plated coating film, tin electroplating method, and electronic device component
  • Tin electroplating bath, tin-plated coating film, tin electroplating method, and electronic device component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-24 and comparative example 1-12

[0083] Tin electroplating baths of the compositions shown in Tables 1-3 were prepared. In each electroplating bath, lead frames of phosphor bronze (C5191 ), which had been pretreated in the usual manner, were dipped. Use the lead frame as the cathode and the tin plate as the anode respectively, and perform tin electroplating at a bath temperature of 45°C and the cathode current density shown in Table 1-3 to form a 2-3 μm thick tin plating film.

[0084] Then, after the lead frame with the tin-plated film formed thereon was placed under constant temperature and humidity conditions of 30° C. and 60% RH for 1 week, the surface of the tin-plated film on the lead frame was microscopically observed through a scanning electron microscope, and each Unit area (0.51mm×0.42mm≈0.21mm 2 ) on the number of 10 μm or longer whiskers. In addition, the longest whisker length is also detected. The reason for counting only whiskers of 10 μm and longer is based on the definition of whiskers giv...

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Abstract

Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.

Description

technical field [0001] The invention relates to a tin electroplating bath, a tin plating film and a tin electroplating method for replacing tin-lead alloy electroplating, and the invention also relates to electronic device components. Background technique [0002] For components that require soldering, such as chip components, crystal oscillators, bumps, connectors, lead frames, ferrules, semiconductor packages and components of electronic devices for printed circuit boards, tin-lead alloy plating is generally applied. In the manufacture of printed circuit boards and the like, tin-lead alloy plating films have been widely used as anti-corrosion films. [0003] In recent years, however, stricter regulations have been introduced on the use of lead as an environmental protection measure, which has led to a desire to use lead-free plating instead of tin-lead alloy plating materials. Lead-free tin alloy plating is one such lead-free plating and is being widely developed. Exampl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30
CPCH01L2924/01015H01L2924/01084H05K3/244H01L2924/04953H01L2924/01004H01L2924/01025C25D3/32H01L24/27H01L2924/09701H01L2924/01019H01L2924/01327H01L2924/01005H01L24/11H01L23/49582H01L2924/0102C25D3/30H01L2924/01074H01L2924/01078H01L2924/01042H01L2924/01027C25D3/60C25D7/12H01L2924/01012H01L2224/11822Y10T428/31678
Inventor 梁田勇辻本雅宣
Owner C UYEMURA & CO LTD
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