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Recovery method of waste circuit board

A recycling method and printed circuit board technology, applied in the field of resource recycling and reuse of waste electronic and electrical products, can solve the problems of high energy consumption, easy pollution of the environment, high energy consumption and environmental pollution, and achieve low energy consumption, good quality, The effect of simple equipment

Inactive Publication Date: 2010-12-08
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two types of equipment rely on shearing, impact and centrifugation to crush waste circuit boards. Although the crushing efficiency has been improved, they still have the disadvantages of high energy consumption and easy environmental pollution.
[0014] The above method separates and recycles the waste circuit board components, and the recycling process has the disadvantages of high energy consumption and easy pollution of the environment.

Method used

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  • Recovery method of waste circuit board
  • Recovery method of waste circuit board
  • Recovery method of waste circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] 1. Put the discarded circuit boards with electronic components in an oil bath at 220°C to 300°C and heat until the solder melts. Then, put the discarded circuit boards with melted solder in a centrifuge, start the motor to rotate for 6 minutes, and solder It is detached from the circuit board under the centrifugal force generated by the rotation to realize recycling.

[0038] 2. Place the desoldered substrate and electronic components in a vacuum pyrolysis device and heat them to 500°C, hold the final temperature for 20 minutes, collect the gas generated by thermal cracking, and condense into liquid oil in a -20°C condensing device.

[0039] 3. Collect the pyrolysis oil obtained from pyrolysis, the circuit board substrate and electronic components after pyrolysis, so that the next step can be classified and recovered or separated and recovered.

[0040] in conclusion:

[0041] ①In the desoldering step, all electronic components fall off, and no electronic components ar...

Embodiment 2

[0044] 1. Put the discarded circuit boards with electronic components in an oil bath at 220°C to 300°C and heat until the solder melts. Then, put the discarded circuit boards with melted solder in a centrifuge, start the motor to rotate for 8 minutes, and solder It is detached from the circuit board under the centrifugal force generated by the rotation to realize recycling.

[0045] 2. Place the desoldered substrate and electronic components in a vacuum pyrolysis device to heat to 550°C, hold the final temperature for 30 minutes, collect the gas generated by thermal cracking, and condense it into liquid oil in a -30°C condensing device.

[0046] 3. Collect the pyrolysis oil obtained from pyrolysis, the circuit board substrate and electronic components after pyrolysis, so that the next step can be classified and recovered or separated and recovered.

[0047] in conclusion:

[0048] ①In the desoldering step, all electronic components fall off, and no electronic components are a...

Embodiment 3

[0051] 1. Put the discarded circuit boards with electronic components in an oil bath at 220°C to 300°C and heat until the solder melts. Then, put the discarded circuit boards with melted solder in a centrifuge, start the motor to rotate for 10 minutes, and solder It is detached from the circuit board under the centrifugal force generated by the rotation to realize recycling.

[0052] 2. Place the desoldered substrate and electronic components in a vacuum pyrolysis device to heat to 600°C, hold the final temperature for 40 minutes, collect the gas generated by thermal cracking, and condense it into liquid oil in a -40°C condensing device.

[0053] 3. Collect the pyrolysis oil obtained from pyrolysis, the circuit board substrate and electronic components after pyrolysis, so that the next step can be classified and recovered or separated and recovered.

[0054] in conclusion:

[0055] ①In the desoldering step, all electronic components fall off, and no electronic components are ...

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Abstract

The invention provides a method for recovering waste circuit boards. The method comprises the following: 1. a step of heating and centrifugally separating, which is to put the waste circuit boards in an oil bath, heat to melt solder and pass the waste circuit boards with the solder melted through a centrifugal machine so as to efficiently separate the solder from the waste printed circuit boards;2. a step of cracking in vacuum, which is to put waste circuit board substrates with the solder removed, as well as an electron component in a vacuum cracking device, heat for thermal cracking, collect thermal-cracking volatile products and condense the volatile products into fluid oil; and 3. a step of collecting solid matter after vacuum cracking, which is to classify and collect the electron component and the circuit board substrates after thermal cracking, so as to recover precious metals and other valuable metals of the electron component, as well as copper foil, glass fiber and other substances on the circuit board substrates. The method performs treatment by stages according to the structural characteristics of the waste circuit boards, has the advantages of simplicity, no pollution, low cost, high efficiency and high rate of recovering waste resources of the waste circuit boards, and is suitable for industrial application and the large-scale recovery of the waste circuit boards.

Description

technical field [0001] The invention discloses a method for recycling waste circuit boards, which belongs to the technical field of resource recovery and reuse of waste electronic and electrical products. Background technique [0002] The present invention is a recycling process researched and developed for a large number of waste printed circuit boards (printed circuit board, PCB). With the rapid development of the economy and the electronic information industry, the replacement of electronic and electrical products is increasing, and the service life of the products is shortened, resulting in a large number of electronic products being discarded. Waste printed circuit boards are a major part of electronic waste, and their recycling has become a global problem that needs to be solved urgently. Discarded circuit boards are different from general solid waste. In addition to precious metals and other valuable metals, they also contain lead, cadmium, mercury, hexavalent chromi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B09B3/00C22B25/06C10G1/00
CPCY02P10/20Y02W30/82
Inventor 丘克强周益辉
Owner CENT SOUTH UNIV
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