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Polishing composite for hard disk substrate

A technique for polishing compositions and disk substrates, applied in the field of polishing compositions, can solve problems such as surface roughness to be reduced, deep scratches, protrusions, polishing rate, and insufficient effect of improving surface quality, etc., to achieve polishing removal rate High, less surface scratches, smooth surface effect

Inactive Publication Date: 2009-06-24
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to research, these polishing solutions are not effective in increasing the polishing rate and improving the surface quality. There are still defects such as deep scratches and protrusions on the surface. The polishing effect cannot meet the needs of hard disk substrates, and the surface roughness needs to be reduced.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A polishing composition for a hard disk substrate, comprising abrasives and water, also comprising a polishing accelerator and a lubricant, in percentages by weight, as abrasive aluminum oxide (purity is about 99.9%, the average of primary particles Particle size is 0.2 micron, the average particle size of the secondary particles is 0.5 micron): 6%, lactic acid as a polishing accelerator: 0.3%, lauric acid alkanolamide sulfate as a lubricant: 0.0002%, the rest is deionized water.

[0034] Under mechanical stirring conditions, add aluminum oxide, lactic acid, and lauric acid alkanolamide sulfate into deionized water according to the above ratio, mix and stir evenly, add an appropriate amount of hydrochloric acid as a pH regulator, adjust the pH value to 2.23, and prepare a polished combination.

[0035] The prepared polishing composition is used for the polishing of the hard disk substrate, and the polishing conditions are as follows:

[0036] Polishing machine: double...

Embodiment 2

[0062] A polishing composition for a hard disk substrate, comprising abrasives and water, also comprising a polishing accelerator and a lubricant, in percentages by weight, as abrasive aluminum oxide (purity is about 99.9%, the average of primary particles Particle size: 0.3 μm, average particle size of secondary particles: 0.9 μm): 7%, malic acid as a polishing accelerator: 0.1%, alkanolamide succinic acid monoester sulfonic acid disodium salt as a lubricant: 0.03 %, lauric acid amide phosphate as a lubricant: 0.02%, and the rest is distilled water.

[0063] Under the condition of mechanical stirring, add aluminum oxide, malic acid, alkanolamide succinic acid monoester sulfonic acid disodium salt, lauric acid amide phosphate into distilled water according to the above ratio, mix and stir evenly, and add an appropriate amount of phosphoric acid as the pH value Regulator, adjust the pH value to 2.04, and prepare the polishing composition.

[0064] The prepared polishing compos...

Embodiment 3

[0066] A polishing composition for a hard disk substrate, comprising abrasives and water, also comprising a polishing accelerator and a lubricant, in percentages by weight, as abrasive aluminum oxide (purity is about 99.9%, the average of primary particles Particle size: 0.5 μm, average particle size of secondary particles: 1.1 μm): 3%, citric acid as a polishing accelerator: 0.2%, salicylic acid as a polishing accelerator: 0.05%, stearin as a lubricant Acid alkanolamide sulfate: 0.0005%, the rest is deionized water.

[0067] Under the condition of mechanical stirring, add alumina, citric acid, salicylic acid, stearic acid alkanolamide sulfate into deionized water according to the above ratio, mix and stir evenly, add an appropriate amount of nitric acid as a pH regulator, and adjust the pH 3.25, formulated as a polishing composition.

[0068] The prepared polishing composition was used to polish the hard disk substrate, and then the surface quality and removal rate of the di...

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Abstract

The invention discloses a polishing composition for hard disk substrates, belonging to the technical field of manufacturing memory hard disks of a computer. A polishing composition for the hard disk substrates includes grinding materials and water, and further includes a polishing accelerating agent and a lubricating agent, the contents thereof based on weight percent are as below: the grinding materials: 0.5-20%, the polishing accelerating agent:0.01-10%; the lubricating agent: 0.00001-5%, the rest is water. The polishing composition further includes a pH regulator. The pH value of the polishing composition is 0.5-5. The polishing composition provided by the invention is mainly suitable for the polishing process in manufacturing the hard disk substrates, and has the characteristic of high polishing removal rate, the polished disk substrate is less in scratches on the surface and free from recesses, protrusions and the like, as well as has smooth surface and the average surface roughness that can reach 3 angstroms or below.

Description

technical field [0001] The invention belongs to the technical field of computer memory hard disk manufacture, in particular to a polishing composition for hard disk substrates. Background technique [0002] With the application of perpendicular magnetic recording technology in hard disks, the storage density of disks has been greatly increased, and the storage capacity of hard disks has expanded rapidly. At the same time, the flying height of the hard disk head is required to be further reduced, which requires that the surface of the hard disk substrate is smoother, the surface roughness is smaller, and there are no defects on the surface of the disk substrate. Through the "high and precise" polishing of the hard disk substrate, the improvement of its surface quality is realized. [0003] The magnetic head moves along the surface of the hard disk substrate to read and write information. If there are bumps on the disk substrate, "head crushing" is prone to occur, thereby da...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02C23F3/00
Inventor 潘国顺周艳罗桂海雒建斌路新春刘岩
Owner TSINGHUA UNIV
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