Single-component surface pasting adhesive capable of being rapidly cured

Abstract

The invention discloses a fast-curable one-component surface mount adhesive, which is composed of a liquid epoxy resin, a modified epoxy resin, a reactive diluent, a latent curing agent, an accelerating agent, a thixotropic agent, an inorganic filler and a paint. The components thereof have the following weight percents: 20-80% of the liquid epoxy resin, 0-10% of the modified epoxy resin; 1-10% of the reactive diluent; 1-9% of the latent curing agent; 2-18% of the accelerating agent; 3-10% of the thixotropic agent; 0-30% of the inorganic filler and 0-3% of the paint. The invention, compared with the current product, is low in viscosity, excellent in thixotropy and remarkable in electrical performance and can be rapidly cured in 90 seconds under the temperature of 120 DEG C, furthermore, the invention has high adhesion force and good heat and impact resistance, thus can be applied to the technical field of the surface mount.

Description

technical field [0001] The present invention relates to a surface mount adhesive, in particular to a rapidly curable one-component surface mount adhesive mainly used for wave soldering and reflow soldering. Background technique [0002] Due to the pursuit of miniaturization of electronic products, the perforated plug-in components used in the past can no longer be reduced, and the functions of electronic products are more complete. The integrated circuits (IC) used have no perforated components, especially large-scale and highly integrated ICs have to use SMD components , product batching, production automation, the factory should produce high-quality products at low cost and high output to meet customer needs and strengthen market competitiveness, the development of electronic components, the development of integrated circuits (IC), the multiple applications of semiconductor materials, etc., electronics The rapid development of technology has promoted the continuous develop...

AI Technical Summary

Problems solved by technology

[0004] One-component epoxy surface mount adhesives have the following characteristics: good dispensing performance, consistent dot profile and size, high wet strength and cured strength, fast curing speed, storage stability, flexibility and temperature resistance Impact and other characteristics, however, as a one-component adhesive, the two characteristics of fast curing and storage stability are contradictory. If the curing speed is increased, the storage period will definitely be shortened, and the viscosity will increase, which will affect the operability. Storage stability, then the curing speed will slow down, affecting the bonding strength, so that the components will easily fall off during wave soldering

Traditional adhesives cannot achieve fast curing, high bonding strength and stable storage period. Therefore, we have invented a single-component epoxy resin surface mount that can not only cure quickly, but also have high bonding strength and stable storage period. Adhesive