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Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition

A resin composition, a technology for circuit substrates, which are applied in the bonding method of adhesive heating, maintenance/correction of printed circuits, assembling printed circuits with electrical components, etc. The problem of increase, unit price, etc.

Inactive Publication Date: 2009-07-08
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] As described above, since the unit prices of electronic components and circuit boards are high, when a circuit board on which an electronic component is mounted (hereinafter also referred to as a mounted circuit board) is recognized as a non-standard product, the completed The entire mounted circuit board is directly discarded, and the amount of industrial waste increases as the cost of end products increases, so it is not preferable in terms of imposing a load on producers, consumers, and the environment.
[0008] In addition, on the mounted circuit board that is regarded as a non-standard product, there are also boards where electronic components are damaged due to various reasons including heating history, but on the other hand, only the position and location of electronic components mounted on the circuit board / or inappropriate orientation, while the substrate itself and / or the individual electronic components mounted are not damaged, and the components that maintain the necessary functions are also present to a large extent

Method used

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  • Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition
  • Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0139] The following operations are performed on the circuit board in the temporary fixing stage, and recycling is performed without damaging both the circuit board and the miniature transistors. Place the circuit board on a table adjacent to a hot air heater capable of blowing hot air at 80°C, and use a thermocouple to measure the temperature (T1) of the circuit board surface below the miniature transistor and the temperature (T2) of the resin composition. , blowing hot air. The resin composition is a composition in which a bisphenol A type epoxy resin is blended with a mercaptan curing agent, an organic-inorganic composite insulating filler, and an imidazole curing accelerator.

[0140] The glass transition temperature (Tg) of the resin composition used for this temporary fixing was measured in advance using a dynamic viscoelasticity measuring device (manufactured by Seiko Instruments Co., Ltd.), and it was about 42°C.

[0141] Therefore, hot air is blown until T2 becomes 4...

example 2

[0145] Assuming that there is an abnormality in the electronic component, it should be recycled without damaging the circuit board, and the circuit board in the temporary fixing stage is processed as follows. The resin composition had the same composition as in Example 1, and its glass transition temperature (Tg) was about 42°C. Using a thermocouple in the same manner as in Example 1, the temperature ( T1 ) of the circuit board surface below the mini-transistor and the temperature ( T2 ) of the resin composition were measured.

[0146] Press the soldering iron on the mini transistor fixed on the circuit board with the resin composition, bring T2 to 50°C, and pick the mini transistor with tweezers. T1 at this time was 75°C. As in Example 1, the resin composition was easily broken, and the miniature transistors could be easily separated from the circuit board.

[0147] Thereafter, the mini-transistor was transferred to the electronic component recovery process, but it was not ...

example 3

[0149] In the case of the same circuit board as in Example 1, the circuit board taken out from the flow soldering step (S4) was processed through the repairing step (R2). The following operations are performed on the circuit board of the soldering process, and recycling is performed without damaging both the circuit board and the miniature transistors.

[0150] Surround the reed of the mini-transistor with a copper mesh, apply a soldering iron to the reed, melt most of the attached solder, suck it onto the copper mesh and remove it. Thereafter, the circuit board was placed on a table adjacent to a hot air heater capable of blowing hot air at 80° C., and the resin composition was softened by blowing hot air while measuring the temperature (T1 and T2) in the same manner as in Example 1.

[0151] As in Example 1, the resin composition was easily broken, and the miniature transistors could be easily separated from the circuit board.

[0152] Thereafter, the miniature transistors ...

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Abstract

This invention provides a resin composition which can prevent damage to a low-heat resistant component upon heating in a process for mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards, which have been determined as off-specification products in the mounting process, and a method for separating and collecting useful boards and / or electronic components from circuit boards, which have been determined as off-specification products in the mounting process. The resin composition comprises, based on (A) 100 parts by weight of epoxy resin, (B) 30 to 200 parts by weight of a thiol curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole curing accelerator . In the collecting method, a part or the whole of the circuit board in the mounting process is heated in the temperature range of the glass transition point of the resin composition to 110 C to soften the resin composition,and electronic components are separated and collected from the circuit board.

Description

technical field [0001] The present invention relates to a thermosetting resin composition for forming a circuit board of an electric appliance. Moreover, this invention also relates to the mounting method of mounting an electronic component on a circuit board using the said thermosetting resin composition. [0002] The present invention also relates to a method for separating and recovering electronic components from circuit boards that fail specifications during the mounting process of the circuit boards. In addition, the present invention relates to a method for mounting a circuit board, which includes: a mounting process for mounting a circuit board for manufacturing an electric appliance; a recovery process for implementing the above recovery method using the circuit board sorted and discharged from the mounting process; A recycling process in which the electronic components and / or circuit boards collected in the above recycling process are recycled. Background techniqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/66C08K9/04C08L63/00C09J5/06C09J11/02C09J163/00H05K3/34
CPCH05K3/225H05K3/306C08G59/686C08G59/66C08L63/00H05K3/305H05K2201/0209C08K9/04H05K2203/1105H05K2203/176Y02P20/582Y02P70/50
Inventor 宫川秀规桑原凉酒谷茂昭山口敦史齐藤进岸新
Owner PANASONIC CORP
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