Heat-resistant adhesive sheet

An adhesive sheet, heat-resistant technology, applied in the direction of film/sheet adhesives, adhesives, electrical components, etc., can solve the problem of contamination of silicone residues, etc., and achieve the effect of high dimensional stability

Inactive Publication Date: 2009-07-08
TORAY ADVANCED MATERIALS KOREA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when the sheet is peeled off, the silicone adhesive can cause staining or leave a sticky silicone residue on the surface to which it is attached

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0056] In order to prepare a UV-curable thermosetting adhesive, for 100 parts by weight of the total liquid, the following were used: 46.28 parts by weight of acrylic adhesive resin (AT-211, commercially available from Samwon Co.), 1.62 parts by weight Parts of isocyanate hardener (CAT-45, commercially available from Samwon Co.), 5.55 parts by weight of urethane acrylate (which is an energy ray-curable oligomer) (EB280, commercially available from Cytec Co.), 0.19 parts by weight of 2,4,6-trimethylbenzoyl-diphenylphosphine (Darocur TPO, commercially available from Ciba Co.), 0.08 parts by weight of hydroxycyclohexylbenzophenone (Irgacure184, commercially available from Ciba Co.) (which is an ultraviolet initiator) and 46.28 parts by weight of ethyl acetate solvent. Then, the adhesive prepared above was coated on a heat-resistant substrate polyimide film (25NPI, commercially available from Kaneka Co., 25 µm) in a thickness of 10 µm, and the resulting film was dried. Subsequent...

Embodiment approach 2

[0058] In order to prepare a UV-curable thermosetting adhesive, for 100 parts by weight of the total liquid, the following were used: 47.1 parts by weight of acrylic adhesive resin (AT-211, commercially available from Samwon Co.), 1.7 parts by weight Parts of isocyanate hardener (CAT-45, commercially available from Samwon Co.), 2.8 parts by weight of urethane acrylate (which is an energy ray-curable oligomer) (EB280, commercially available from Cytec Co.), 0.1 parts by weight of 2,4,6-trimethylbenzoyl-diphenylphosphine (Darocur TPO, commercially available from Ciba Co.), 0.2 parts by weight of hydroxycyclohexylbenzophenone (Irgacure184, commercially available from Ciba Co.) (which is an ultraviolet initiator) and 48.1 parts by weight of ethyl acetate solvent. Then, the adhesive prepared above was coated on a heat-resistant substrate polyimide film (25NPI, commercially available from Kaneka Co., 25 µm) in a thickness of 10 µm, and the resulting film was dried. Subsequently, in...

Embodiment approach 3

[0060]In order to prepare a UV-curable thermosetting adhesive, for 100 parts by weight of the total liquid, the following were used: 46.28 parts by weight of acrylic adhesive resin (AT-211, commercially available from Samwon Co.), 1.62 parts by weight Parts of isocyanate hardener (CAT-45, commercially available from Samwon Co.), 1.85 parts by weight of urethane acrylate (which is an energy ray-curable oligomer) (EB280, commercially available from Cytec Co.), 3.7 parts by weight of phenyl novolac (novlac) acrylate (EB9656, commercially available from Cytec Co.) (which is an energy ray curable oligomer), 0.19 parts by weight of 2,4,6-trimethyl Benzoyl-diphenylphosphine (Darocur TPO, commercially available from Ciba Co.), 0.08 parts by weight of hydroxycyclohexylbenzophenone (Irgacure184, commercially available from Ciba Co.) (it is an ultraviolet initiator) and 46.28 Parts by weight of ethyl acetate solvent. Then, the adhesive prepared above was coated on a heat-resistant subst...

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Abstract

The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature. To this end, the heat-resistant adhesive sheet (tape) according to the invention is characterized by comprising a heat-resistant substrate, and an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid comprising energy ray curable olygomer resin, thermosetting adhesive resin, energy ray initiator and thermosetting agent, the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction.

Description

technical field [0001] The present invention relates to a heat-resistant adhesive sheet (tape). More specifically, the present invention relates to a heat-resistant adhesive sheet having high reliability and processability, in which a crosslinking reaction can be induced by irradiating an energy ray on the adhesive layer to achieve heat resistance at high temperature and in parts High dimensional stability in medium, enabling peeling of the adhesive layer without leaving adhesive residue on the attached surface, and achieving no oxidation at high temperatures on the attached surface, such as a metal surface. [0002] In addition, the sheet of the present invention can be widely used as an adhesive sheet suitable for use as a masking sheet for various electronic parts in a high-temperature process. In the following description, a semiconductor packaging process will be exemplified, but Note that the present invention cannot be limited thereto. Background technique [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B32B7/12H01L23/14C09J7/22C09J7/30
CPCC09J7/0292C09J7/0264C09J2401/006C09J7/0239C09J2479/086C09J2477/006H01L21/6835C09J2203/326C09J2467/006C09J2400/163C09J2481/006C09J2433/00H01L23/293H01L2924/0002C09J7/22C09J7/30Y10T428/2809Y10T428/2804H01L2924/00
Inventor 李准浩全海尚文基祯沈昌勋
Owner TORAY ADVANCED MATERIALS KOREA
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