Vacuum magnetron sputtering coil film coating apparatus

Abstract

A vacuum magnetron sputtering winding coating device comprises a vacuum cavity, a vacuum generating system, target electrodes, and a winding and unwinding system, wherein, the vacuum generating system is arranged on the vacuum cavity to cause the interior of the vacuum cavity to be in vacuum state at work, the target electrodes for magnetron sputtering are arranged at the magnetron sputtering area in the vacuum cavity, two rows of target electrodes are arranged, and the winding and unwinding system is respectively arranged at the tow sides of the magnetron sputtering area. The invention has the advantages that: (1) the vacuum cavity is designed as round to provide uniform vacuum degree without forming air suction dead angles; oil returning doses not appear in the vacuum chamber; and the work efficiency is improved; (2) two winding and unwinding systems are adopted to satisfy dual-coating of one roll and single-coating of two rolls with full width of the magnetron sputtering area as well as single-and dual-coating of two rolls with half width of the coating area, so that the function is comprehensive; (3) ion bombardment is carried out on the base material surface to enhance the surface roughness of the base material and guarantee the peel strength between the base material and the film.

Description

technical field [0001] The invention relates to the field of coating equipment for continuous film formation by magnetron sputtering on the surface of various substrates in a high vacuum state, specifically a vacuum that can be applied to sputtering one or more layers of metal on a roll-shaped substrate. Magnetron sputtering roll-to-roll coating device. Background technique [0002] Vacuum magnetron sputtering equipment can obtain one or more uniform deposition layers on conductive substrates and non-conductive substrates. It is an important equipment for obtaining various functional films and can be applied to EMI, flexible circuit boards, optical coatings, etc. industry. At present, the commonly used vacuum magnetron sputtering coating machine consists of a vacuum chamber, a vacuum acquisition system, a winding system, a sputtering target system and an automatic control system. The operation procedure is as follows: feeding - closing the vacuum chamber door - turning on ...

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Problems solved by technology

[0003] The above-mentioned vacuum magnetron sputtering coating machine sputters the required metal layer on one side of the roll substrate, and has the following disadvantages: (1), the vacuum chamber of the coating machine usually adopts a square chamber, and the vacuum obtaining system adopts an oil diffusion pump The system is distributed on both sides of the vacuum chamber. This layout causes uneven vacuum in the vacuum chamber, resulting in uneven sputtering film thickness; the oil diffusion pump often returns oil, which will cause the workpiece substrate in the vacuum chamber An oil film is formed on the surface, resulting in poor bonding between the sputtering film and the substrate; in addition, the power consumption of the oil diffusion pump is relatively large, because its control method is switch value control, so even if the pumping speed of the process becomes small, it can only use full power. output, the energy consumption is very large

(2) Usually only one set of rewinding and unwinding system is configured, so only one roll can be sputtered, and the work efficiency is low

(3) Usually, it is only equipped with sputtering targets, and not equipped with ion source treatment. When plating certain substrates, the peeling strength between the film layer and the substrate will be insufficient.

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