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Inspection method and equipment, photolithography equipment and method for manufacturing photolithography processing unit and device

A technology for testing equipment and optical components, applied in the field of scatterometers, can solve problems such as inapplicability of optical systems, complicated technology, and difficulties

Inactive Publication Date: 2012-01-25
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Techniques for achromatizing optical systems involving refractive optics are well known, but become more complex and difficult as the number or range of wavelengths to be accommodated increases
Optical systems employing mirrors such as those based on Schwarzschild optics can be more easily made achromatic, but due to obscurations in the pupil plane, said optical systems are not suitable, especially for those with high Numerical aperture optics for scatterometers and ellipsometers

Method used

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  • Inspection method and equipment, photolithography equipment and method for manufacturing photolithography processing unit and device
  • Inspection method and equipment, photolithography equipment and method for manufacturing photolithography processing unit and device
  • Inspection method and equipment, photolithography equipment and method for manufacturing photolithography processing unit and device

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Embodiment Construction

[0026] Fig. 1 schematically shows a lithographic apparatus according to an embodiment of the invention. The equipment includes:

[0027] an illumination system (illuminator) IL configured to condition a radiation beam B (eg, ultraviolet radiation or deep ultraviolet (DUV) radiation);

[0028] a support structure (e.g. a mask table) MT configured to support a patterning device (e.g. a mask) MA and connected to a first positioner PM configured to precisely position the patterning device according to determined parameters;

[0029] a substrate table (e.g. wafer table) WT configured to hold a substrate (e.g. a resist-coated wafer) W and connected to a second positioner PW configured to precisely position the substrate according to determined parameters ;as well as

[0030] a projection system (e.g., a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion C (e.g., comprising one o...

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Abstract

A scatterometer is provided with a radiation source which can be emitted and radiated within different first and second wavelength scopes. An adjustable optical element setting is used for realizing the color aberration amendment according to the need of used wavelength scope. A single-scattering instrument can thus adopt a wavelength with wide intervals for realizing measurement.

Description

technical field [0001] The invention relates to a method which can be used for inspection, for example in the manufacture of devices by lithography, and to a method, in particular a scatterometer method, for the manufacture of devices using lithography. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, a portion including a portion of a die, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred via imaging to a layer of radiation sensitive material (resist) provided on the substrate. Typically, a si...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 阿瑞·杰弗里·单勃拂斯特尼斯拉伍·Y·斯米尼挪伍安戴尔·琼比尤尔
Owner ASML NETHERLANDS BV