Process for etching solar cells by combining acid and alkali

A technology for solar cells and acid texturing, applied in sustainable manufacturing/processing, circuits, electrical components, etc., can solve the problems of high impact on solar cell performance due to surface compounding of silicon wafers, so as to improve light conversion efficiency and reduce surface compounding degree. , the effect of reducing reflectivity

Inactive Publication Date: 2009-08-26
TRINASOLAR CO LTD
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Problems solved by technology

[0003] In order to overcome the above-mentioned defects, the technical problem to be solved by the present invention is to provide an acid-base combined so

Method used

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Embodiment Construction

[0012] The P-type silicon wafer used in the silicon wafer has a resistance of 0.2 to 30Ωcm.

[0013] a. Acid texturing: HF and HNO 3 Mixed acids of HF and HNO 3 The ratio is 1:1, acid texturing is carried out on the P-type silicon wafer, the acid texturing temperature is 2-7°C, the best is 5°C, the corrosion time is 1-3 minutes, the best is 2 minutes, and then the The P-type silicon wafer is taken out, and the etching depth of the P-type silicon wafer is about 2 microns;

[0014] b. Alkali texturing: Clean the P-type silicon wafers that have been acid-textured to remove the acid solution remaining on the surface, and avoid the neutralization of the acid solution and the lye, which will affect the effect of the alkali velvet. The percentage concentration of the lye used is 5% Potassium Hydroxide solution, carry out alkaline corrosion on the P-type silicon chip that has been acid-textured. It takes 3 to 5 minutes, preferably 4 minutes, to form a textured silicon chip, and the...

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Abstract

The invention relates to the technical field of solar cells manufacturing, in particular to a process for etching solar cells by combining acid and alkali. The process comprises the following steps: a, acid-etching: carrying out light-etching on the surface of a silicon chip with HF and HNO3; and b, alkali-etching: cleaning the light-etched silicon chip and further carrying out deep-etching with potassium hydroxide solution or sodium hydroxide solution to finish etching the silicon chip. The invention solves the problem that the performance of the solar cells is affected by the high surface recombination of the silicon chip in the existing etching process.

Description

technical field [0001] The invention relates to the technical field of solar cell production, in particular to an acid-base combination solar cell texturing process. Background technique [0002] A solar cell is a new type of energy conversion device. The core component of a solar cell is a silicon wafer. The strength of the silicon wafer's ability to reflect sunlight directly affects the performance of the solar cell, and the solar cell manufacturing process directly affects the silicon wafer. The reflection ability of the silicon wafer to sunlight is the process of silicon wafer texturing. Generally, the silicon wafer must be surface treated before the silicon wafer is textured. The purpose of the surface treatment is to reduce the surface recombination rate of the silicon wafer. The existing surface The treatment method is mainly the traditional method, which generally uses a large amount of chemical reagents and water sources for cleaning. In this way, most of the chemic...

Claims

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Application Information

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IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 张军
Owner TRINASOLAR CO LTD
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