Method for manufacturing transparent cured film using positive-working photosensitive resin layer for half exposure
A technology of photosensitive resin layer and manufacturing method, applied in the manufacture of semi-transmissive liquid crystal display elements, in the field of manufacturing transparent cured films, can solve the problem of limited mask adjustment, increased exposure, and difficulty in increasing the output of manufactured elements and other issues to achieve the effect of wide exposure margin and high sensitivity
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[0218] Hereinafter, examples are given to illustrate the present invention in more detail, but the present invention is not limited by these examples.
[0219] [Abbreviations used in Examples]
[0220] The meanings of the abbreviations used in the following examples are as follows.
[0221] MAA: Methacrylic acid
[0222] MMA: methyl methacrylate
[0223] HEMA: 2-hydroxyethyl methacrylate
[0224] CHMI: N-cyclohexyl maleimide
[0225] AIBN: Azobisisobutyronitrile
[0226] PGMEA: Propylene glycol monomethyl ether acetate
[0227] PGME: Propylene glycol monomethyl ether
[0228] PAG1: CGI1397 (trade name) manufactured by チバ·スペシヤイ·ケミカルズ Co., Ltd. / compound name: 2-methyl-α-[5-[[(propanesulfonyl)oxy]imino]-(5H)-thiophene Phenylacetonitrile (compound of formula (7))
[0229] PVE1: Tris(4-(vinyloxy)butyl) trimellitate
[0230] PVE2: 1,4-cyclohexanedimethanol divinyl ether
[0231] NCO1: VESTAGON (registered trademark) B 1065 (trade name) manufactured by Dysa AG / compound name: ε-caprolactam block pol...
Synthetic example 1
[0239] Use 19.4g MAA, 35.3g CHMI, 25.5g HEMA, 19.8g MMA as the monomer components constituting the specific copolymer, and 5g AIBN as the radical polymerization initiator. By putting them in 212.5g solvent PGMEA at a temperature of 60°C The polymerization reaction was performed at ~100°C to obtain a component (A) (specific copolymer) solution (specific copolymer concentration: 32.0% by mass) having an Mn of 4100 and Mw of 7600. (P1)
Synthetic example 2
[0241] Use 15.5g MAA, 35.3g CHMI, 25.5g HEMA, 23.7g MMA as the monomer components constituting the specific copolymer, and 5g AIBN as the radical polymerization initiator. By putting them in 212.5g solvent PGMEA at a temperature of 60°C The polymerization reaction was performed at ~100°C to obtain a component (A) (specific copolymer) solution (specific copolymer concentration: 32.0% by mass) having an Mn of 4400 and Mw of 7000. (P2)
[0242]
[0243] According to the composition shown in Table 1 below, by mixing (B) component, (C) component, (D) component and (E) solvent, and (F) component in a solution of component (A) in a prescribed ratio, It stirred for 30 minutes at a temperature of 23°C, or stirred at 35°C for 3 to 3 days to prepare a uniform solution, thereby preparing the positive photosensitive resin composition solution of each example and each comparative example.
[0244] [Table 1]
[0245] (A) Ingredient
The solution
(g)
(B) Ingredient
(g)
(C) Ingredi...
PUM
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