Organic silver complex compound used in paste for conductive pattern forming

Abstract

An organic silver complex compound is provided to show high solubility in a solvent and be present in the liquid state at room temperature, thereby the content of silver in a conductive pattern-forming paste being increased without an extract solvent or with a small amount of the solvent and forming the conductive pattern forming paste with excellent stability and easy industrial applicability without adding a dispersant. An organic silver complex compound is characterized in that an organic ligand including an amine group(-NH2) and a hydroxyl group(-0H) is bonded with aliphatic silver(Ag) carboxylate at an equivalent ratio of 2:1 to form a complex, wherein the aliphatic silver carboxylate is a silver salt(Ag) of a primary or secondary fatty acid having 2-20 carbon atoms, the organic ligand is selected from the group consisting of primary, secondary, tertiary and quaternary amines substituted with an alcohol group. Further, a viscosity of the organic silver complex compound is 50 to 2000 cPs at room temperature.

Description

technical field [0001] The invention relates to an organic silver coordination compound which can be used in conductive glue and the conductive glue containing the compound. Background technique [0002] Existing methods for forming conductive patterns on substrates include etching methods, vacuum evaporation methods, and screen printing methods, but these methods have problems in that they require complicated and lengthy processes, cause great loss of raw materials, are expensive and cause environmental pollution. In order to solve these problems, ink-jet technology or roll-printing method has been proposed, and they can minimize the loss of raw materials, form conductive patterns using a simple process, and manufacture a film suitable for becoming smaller and smaller. Fine patterns of electronic devices. [0003] These inkjet methods or roll printing methods use a simple process and are inexpensive compared to other methods, but need to manufacture suitable ink or glue i...

AI Technical Summary

Problems solved by technology

[0002] Existing methods for forming conductive patterns on substrates include etching methods, vacuum evaporation methods, and screen printing methods, but these methods have problems in that they require complicated and lengthy processes, cause great loss of raw materials, are expensive and cause environmental pollution

Also, the organic silver composition solution in this patent publication is close to a suspension rather than a solution, and thus has the disadvantage that a large amount of additives must be used to maintain the dispersibility of the silver composition solution

Among conductive pastes, pastes for high-temperature calcination can be made into a continuous conductive film by bonding metal particles to each other through high-temperature heating above 500°C to have a resistivity of less than about 6 μΩcm, but the problem is that due to the high calcination temperature , the substrates on which the glue can be applied are limited

Polymeric glues can exhibit a resistivity of less than about 15 μΩcm, but have the disadvantage of being insufficiently conductive compared to the conductivity of glues intended for high temperature calcinations

Therefore, the roll printing method using a plastic film as a substrate has problems in that it is difficult to use a PET film as commonly used, and in addition, the processing time for firing is long

Since these solvents tend to swell silicone resins that are often used in pattern printing, they cause deterioration in the precision of fine printed patterns

Furthermore, when silver salts of tertiary fatty acids containing more than 10 carbon atoms are used in the paste for low-temperature calcination, it has the disadvantage that the paste causes low initial density of the deposited film when applying the paste to the substrate, Due to the relatively low silver content of the glue, the thickness of the film is greatly different before and after calcination, so the resulting conductive film has a high sheet resistance

[0015] Primary fatty acid silver salts known to increase coating density and silver content have low solubility in common organic solvents

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