Pulsating heat pipe radiator having foam

Abstract

The invention discloses a pulsating heat pipe radiator having foam which comprises radiating foam, a pulsating heat pipe, a radiating seat, a blower and a pulsating heat pipe medium; the pulsating heat pipe is a plurality groups of closed serpentine loop; each group of pulsating heat pipe is divided into heating section and cooling section; bottom of the heating section is embedded in or welded into the radiating seat; the pulsating heat pipe foams with radiating foam; upper part of the radiating foam is provided with the blower; the pulsating heat pipe is filled with the pulsating heat pipe medium. The invention mainly foams the radiating foam at external part of the pulsating heat pipe such that the area of the pulsating heat pipe is greatly increased, and the radiating seat is a temperature-uniforming plate, thereby greatly improving the operating efficiency of the pulsating heat pipe. The invention has the advantages of small volume, light weight, low cost, high heat transfer efficiency and stable operation, and is suitable for cooling the chips of superhuge computer, radiation of high heat flow electronics in large military integrated device, and cooling of the micro-electronics devices needing high radiating performance in limited volume.

Description

technical field [0001] The invention relates to radiators, in particular to a radiator with foamed pulsating heat pipes. Background technique [0002] With the improvement of the integration of electronic components and the improvement of semiconductor manufacturing process, the volume of electronic equipment is getting smaller and smaller, and the functions and complexity of electronic equipment are increasing. Within the limited volume range, the power consumption of electronic equipment is increasing. The heat dissipation increases sharply, and the huge heat flux density causes great difficulties to the design of heat dissipation components. Traditional heat dissipation standards and forced air convection cooling methods are no longer feasible, especially for supercomputer chip cooling, and existing small-volume radiators often cannot meet the requirements. Therefore, the need for a cooling device with high heat transfer rate and constant temperature has become a bottlen...

AI Technical Summary

Problems solved by technology

However, the heat exchange area between the existing heat pipe radiator and the air is limited, so the convective heat transfer thermal resistance R3 will be relatively large

In addition, although the finned radiator increases the heat exchange area with the air and reduces the thermal resistance R3, however, due to the limited increase in the contact area between the heat sink and the air, R3 cannot be greatly reduced, and the finned The thermal conductivity of the chip radiator is relatively low, resulting in a relatively large thermal resistance R2, so the total thermal resistance R is still relatively large under the condition of high heat dissipation requirements in a small volume

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