Bendable low-emission coated glass
A low-emissivity coating and low-emissivity technology, applied in the field of bakeable low-emissivity coated glass, can solve the problems of low-emissivity performance decline, transmittance change, no heat reflection or heat insulation performance, etc., to achieve excellent physical properties, high Deposition efficiency, easy-to-control effects
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Embodiment 1
[0034] After cutting, edging, polishing, washing, and drying, the original green float glass with a thickness of 1.8mm is sequentially coated with SiO with a thickness of 10nm. 0.2 N 1.1 film layer as a transition layer, ZnSnO 2.3 / TiO 1.3 The film layer structure is used as the first dielectric layer, in which ZnSnO 2.3 35nm thick, TiO 1.3 A silver film layer with a thickness of 2.5nm and a thickness of 12nm as a low-emissivity layer, TiO 1.3 / ZnSnO 2.3 The film layer structure is used as the second dielectric layer, in which TiO 1.3 2.5nm thick, ZnSnO 2.3 Si with a thickness of 35nm and a thickness of 12nm 3 N 4 The film layer is used as a protective layer to obtain bakeable low-emissivity coated glass. Among them, the low-emissivity layer and its adjacent layers are TiO1.3 / Ag / TiO 1.3 Structure, plated transition layer, dielectric layer, low-emissivity layer adopts rotating target, and the target material used for silver-plated film layer is planar target. The be...
Embodiment 2
[0041] After cutting, edging, polishing, washing, and drying, the original transparent glass sheet with a thickness of 1.6mm is sequentially coated with SiO with a thickness of 5nm. 0.3 N 0.4 film layer as a transition layer, ZnSnO 0.2 / TiO 0.2 The film layer structure is used as the first dielectric layer, in which ZnSnO 0.2 30nm thick, TiO 0.2 Silver film layer with a thickness of 1.5nm and a thickness of 9nm as a low-emissivity layer, TiO 0.2 / ZnSnO 0.2 The film layer structure is used as the second dielectric layer, in which TiO 0.2 Thickness 1.5nm, ZnSnO 0.2 Si with a thickness of 30nm and a thickness of 10nm 0.3 N 0.4 The film layer is used as a protective layer to obtain bakeable low-emissivity coated glass. Among them, the low-emissivity layer and its adjacent layers are TiO 0.2 / Ag / TiO 0.2 Structure, plated transition layer, dielectric layer, low-emissivity layer adopts rotating target, and the target material used for silver-plated film layer is planar tar...
Embodiment 3
[0048] After cutting, edging, polishing, washing, and drying, the original transparent glass sheet with a thickness of 2.5mm is sequentially coated with SiON with a thickness of 15nm. 0.6 film layer as a transition layer, ZnSnO 3 / TiO 2 The film layer structure is used as the first dielectric layer, in which ZnSnO 3 40nm thick, TiO 2 A silver film layer with a thickness of 3nm and a thickness of 13nm is used as a low-emissivity layer, TiO 2 / ZnSnO 3 The film layer structure is used as the second dielectric layer, in which TiO 2 Thickness 3nm, ZnSnO 3 Si with a thickness of 40nm and a thickness of 15nm 3 N 4 The film layer is used as a protective layer to obtain bakeable low-emissivity coated glass. Among them, the low-emissivity layer and its adjacent layers are TiO 2 / Ag / TiO 2 Structure, plated transition layer, dielectric layer, low-emissivity layer adopts rotating target, and the target material used for silver-plated film layer is planar target.
[0049] The low...
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