Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil

A resin composition and resin coating technology, applied in the direction of improving the metal adhesion of insulating substrates, layered products, metal layered products, etc., can solve the problems of large thickness of prepreg, exposed cloth lines, and difficulties in producing thin copper clad laminates, etc. problem, to achieve the effect of good insulation

Active Publication Date: 2009-11-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] There are some disadvantages in the preparation of high CTI prepregs by using the traditional copper clad laminate production method of impregnating glass fiber cloth and other reinforcing materials with resin composition glue. Copper plates are prone to dry flowers or exposed cloth patterns; the degree of semi-curing of prepregs is not easy to control, which makes it difficult to control the resin fluidity

Method used

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  • Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil
  • Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil
  • Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] (1) Preparation of resin composition

[0047]Add 4 grams of dicyandiamide (DICY) to a clean and dry 750 ml beaker equipped with a stirrer, then add 40 grams of dimethylformamide (DMF) solvent, stir for 10 minutes to completely dissolve DICY, then add 0.200 grams of 2 -Methylimidazole, after dissolving completely, then add 80 grams of methyl ethyl ketone (MEK) to the solution, and stir and mix for 20 minutes. Then start to add 120 grams of aluminum hydroxide (the product of Martin Company in Germany, the trade name is OL-104WE) to the solution, add while stirring, slowly add all the aluminum hydroxide gradually in 2 to 3 minutes, and avoid oxidizing all the hydroxide. Pour the aluminum into the beaker at one time; after adding the aluminum hydroxide, stir and mix at high speed for 30 minutes to disperse the filler evenly. Under the condition of keeping stirring, add 60 grams of brominated bisphenol A epoxy resin (Huntsman company product, brand name Aroldite LZ8008 A80)...

Embodiment 2

[0053] (1) Preparation of resin composition

[0054] Add 4 grams of dicyandiamide (DICY) to a clean and dry 750 ml beaker equipped with a stirrer, then add 40 grams of dimethylformamide (DMF) solvent, stir for 10 minutes to completely dissolve DICY, then add 0.200 grams of 2 -Methylimidazole, after dissolving completely, then add 80 grams of methyl ethyl ketone (MEK) to the solution, and stir and mix for 20 minutes. Then start to add 120 grams of aluminum hydroxide (the product of Martin Company in Germany, the trade name is OL-104WE) to the solution, add while stirring, slowly add all the aluminum hydroxide gradually in 2 to 3 minutes, and avoid oxidizing all the hydroxide. Pour the aluminum into the beaker at one time; after adding the aluminum hydroxide, stir and mix at high speed for 30 minutes to disperse the filler evenly. While keeping stirring, continue to add 30 grams of silicon micropowder (Zhengzhou Jinyuan Micropowder Material Co., Ltd., brand JYEG-11), and stir e...

Embodiment 3

[0058] (1) Preparation of resin composition

[0059] Add 4 grams of dicyandiamide (DICY) to a clean and dry 750 ml beaker equipped with a stirrer, then add 40 grams of dimethylformamide (DMF) solvent, stir for 10 minutes to completely dissolve DICY, then add 0.200 grams of 2 -Methylimidazole, after dissolving completely, then add 80 grams of methyl ethyl ketone (MEK) to the solution, and stir and mix for 20 minutes. Then start to add 120 grams of aluminum hydroxide (the product of Martin Company in Germany, the trade name is OL-104WE) to the solution, add while stirring, slowly add all the aluminum hydroxide gradually in 2 to 3 minutes, and avoid oxidizing all the hydroxide. Pour the aluminum into the beaker at one time; after adding the aluminum hydroxide, stir and mix at high speed for 30 minutes to disperse the filler evenly. Then, add 60 gram of brominated bisphenol A epoxy resins (Huntsman company product, brand name ArolditeLZ8008 A80), 100 gram of bisphenol A type epox...

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Abstract

The invention relates to the technical field of copper-clad plates, in particular to a resin composition, a resin-coated copper foil produced by the same and a copper-clad plate produced by the resin-coated copper foil. The resin composition comprises the following components in percentage by weight: 45 to 80 percent of epoxy resin mixture, 15 to 50 percent of stuffing, 1 to 8 percent of curing agent, 0.01 to 2 percent of curing accelerator, and a proper amount of solvent. The resin composition is used to prepare the resin-coated copper foil, and then the resin-coated copper foil is used to produce the copper-clad plate so as to change the prior manufacturing method of copper-clad plates with high comparative tracking index and solve the technical problems of dry flowers, cloth mark exposure and inadequate thickness accuracy of the copper-clad plate and the like; the resin-coated copper foil also has the characteristics of long storage period, easy management and convenient use; and the resin-coated copper foil has a thin insulating dielectric layer, and is convenient to produce thin copper-clad plates with high comparative tracking index characteristic and multi-layer printed circuit boards.

Description

Technical field: [0001] The invention relates to the technical field of copper-clad boards, in particular to a resin composition, a resin-coated copper foil produced therefrom, and a copper-clad board produced by using the resin-coated copper foil. Background technique: [0002] Copper-clad laminate is a prepreg prepared by impregnating the reinforcing material with a resin composition, drying and semi-curing, and then covering one or both sides of the prepreg with copper foil, hot pressing and curing. A composite material, referred to as copper clad laminate (CCL), which is used to make printed circuit boards (PCB). Printed circuit boards have become an indispensable main component for most electronic products to achieve circuit interconnection. [0003] The resin composition is widely used as a material for copper clad laminates and semiconductor packaging substrates due to its comprehensive properties such as good insulation, heat resistance, mechanical properties, and a...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/22C08K5/315C08K5/3445C08K13/02B32B15/092B32B15/20H05K3/38
Inventor 杨中强陈振文茹敬宏刘东亮苏晓声辜信实佘乃东
Owner GUANGDONG SHENGYI SCI TECH
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