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Method for inhibiting corrosion of metal pad

A metal pad, dry etching technology, applied in metal material coating process, gaseous chemical plating, coating, etc., can solve problems such as metal pad corrosion, achieve corrosion inhibition, solve chip packaging yield decline, Solve the effect of increasing the failure rate of the wire bonding process

Active Publication Date: 2010-02-24
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
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Problems solved by technology

[0003] The purpose of the present invention is to provide a method for inhibiting the corrosion of metal pads, so as to solve the problem that the metal pads are prone to galvanic effect and lead to corrosion of metal pads in a liquid cleaning environment

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  • Method for inhibiting corrosion of metal pad
  • Method for inhibiting corrosion of metal pad
  • Method for inhibiting corrosion of metal pad

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Embodiment Construction

[0016] For the method of suppressing metal pad corrosion of the present embodiment, please refer to figure 1 , which includes the following steps: S1: forming a titanium nitride layer on the prepared metal pad; S2: removing the metal pad after the titanium nitride layer formed in step 1 remains on the metal pad for a preset time TiN layer on top.

[0017] Wherein, the material of the metal pad is an alloy of copper and aluminum. Alloys of copper and aluminum are currently commonly used materials for making metal pads. In this way, the problem of process compatibility existing in the adoption of new materials can be avoided, and the cost can be reduced.

[0018] The thickness of the titanium nitride layer formed in step S1 is 700˜1000 angstroms. In order to minimize the process time and cost occupied by the present invention, the thickness of the titanium nitride formed in step 1 should not be too thick.

[0019] The carbon nitride layer formed in step S1 is formed by chemi...

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Abstract

The invention provides a method for inhibiting corrosion of a metal pad. The metal pad is made from an alloy of aluminum and copper. The method is used for inhibiting the corrosion of the metal pad manufactured on a chip caused by galvanic effect in a cleaning environment. The method comprises the following steps: 1, forming a titanium nitride layer on the metal pad; and 2, after the titanium nitride layer is reserved on the metal pad for a preset time, removing the titanium nitride layer on the metal pad. A small amount of titanium nitride is spread to the metal pad by forming the titanium nitride layer and removing the titanium nitride layer to inhibit the copper in the metal pad from precipitating from a crystal boundary of the aluminum so as to inhibit the corrosion of the metal pad caused by the galvanic effect. The method for inhibiting the corrosion of the metal pad can effectively solve the problems of wire bonding failure rate increase and packaging yield reduction caused by the corrosion of the metal pad on the chip.

Description

technical field [0001] The invention relates to the field of manufacturing metal pads in the semiconductor manufacturing process, in particular to a method for inhibiting the corrosion of the metal pads. Background technique [0002] In the semiconductor chip manufacturing process, making metal pads can realize the electrical connection between the inside of the chip and between the inside and the outside. Then, in the subsequent die saw process, the chip needs to be cleaned with deionized water at a certain temperature. At this time, the metal pad (Pad) fabricated on the chip is easily corroded. Usually the metal pad is an alloy material of Al and Cu. Since Cu is easy to precipitate at the grain boundary of Al, the two metals Al and Cu with different activities are prone to produce a galvanic effect (Galvanic Effect) in a deionized water environment, resulting in active Al with a higher hardness is easily dissolved by corrosion. In the metal pad of Al and Cu alloy, the c...

Claims

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Application Information

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IPC IPC(8): C23C16/34C23C16/52C23F4/00C23F17/00
Inventor 虞勤琴段淑卿李明务林凤
Owner SEMICON MFG INT (SHANGHAI) CORP
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