Chemical plating material and preparation method thereof

A technology of chemical plating and chemical plating, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of weak bonding between metal plating and substrate, low qualified rate of plating, and peeling off of chemical plating, etc. To achieve the effect of short cycle, simple operation and high production efficiency

Inactive Publication Date: 2010-02-24
安徽新合富力科技有限公司
View PDF1 Cites 28 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The activation process uses a powdered substrate for chemical activation to enhance its catalytic activity. Although the interference of tin ions is avoided, the selectivity of this method is very low when the substrate is selectively electroless plated, and the deposition time is long. Usually For 24 hours or even longer, and the bonding force between the metal coating deposited on the substrate and the substrate is not strong, the chemical coating is easy to fall off from the surface of the substrate, and the qualification rate of the coating is low
In addition, in the past 20 years, the prices of various precious metals have soared, and the cost of electroless plating activation with Pd, Rh, Ru or Ag is relatively high. The trend of replacing these precious metals with other cheap materials has become irresistible.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0017] According to the preparation method of the electroless plating material of the present invention, the method includes contacting the plastic substrate with the reducing agent aqueous solution and the divalent copper salt aqueous solution, attaching the elemental copper particle layer to the surface of the plastic substrate, and then performing metal deposition to form the metal plating layer The elementary copper particle layer and the metal plating layer constitute an electroless plating layer, and the contact conditions enable the reducing agent to reduce the divalent copper salt into elemental copper particles with a particle diameter of 15-100 nanometers, and the electroless plating layer and The bonding force between the plastic substrates is 100-400 MPa. The method for contacting the plastic substrate with the aqueous solution of the reducing agent and the aqueous solution of divalent copper salt may be: after the plastic substrate is contacted with the aqueous solu...

reference example 1

[0033] Put 1,000 pieces of 3 cm×3 cm ABS engineering plastic base material (4 grams) of C2950 model C2950 produced by Dongguan Tongxin Engineering Plastics Co., Ltd. into 1 mol / L NaOH and 1 mol / L Na 2 CO 3 And 0.1 mol / L sodium dodecyl sulfonate solution, soak at 50℃ for 10 minutes, take it out and rinse with deionized water twice; then put it in 1 mol / L phosphoric acid solution and soak for 10 minutes , Rinse with deionized water 2 times after taking it out; then put in H containing 1 mol / L 2 SO 4 , 4 mol / L CrO 3 And 0.02 mol / L CrCl 3 ·6H 2 Soak in O solution for 12 minutes at 70°C and rinse with deionized water twice after taking it out.

Embodiment 1

[0035] This embodiment is used to illustrate the electroless plating material and its preparation method provided by the present invention.

[0036] (1) Preparation of electroless plating activation solution: add 0.014 mole of glucose to 50 ml of water, record it as solution A, and keep it constant in a water bath at 80°C. Add 0.024 mol of copper sulfate and 400 wt% of potassium sodium tartrate relative to the weight of copper sulfate in 200 ml of water, and adjust the pH of the solution to 12 with sodium hydroxide, record it as solution B, and keep it constant in a water bath at 80°C;

[0037] (2) Electroless plating activation: Put 10 ABS plastic substrates from Reference Example 1 into the above solution B at 80°C, and then put the above solution A at 0.72×10 per second -5 Add the solution B dropwise at a molar rate, and continue to contact for 10 minutes after the addition is complete, then take out the ABS plastic substrate and rinse with deionized water for 2 minutes. Every 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a chemical plating material, which comprises a plastic substrate and a chemical plating layer, wherein the chemical plating layer comprises a simple substance copper particle layer and a metal plating layer; the simple substance copper particle layer is positioned between the plastic substrate and the metal plating layer; the particle diameter of simple substance copper particles is between 15 and 100 nanometers; and the bonding force between the chemical plating layer and the plastic substrate is between 100 and 400MPa. The invention also discloses a preparation methodfor the chemical plating material, which comprises that: the plastic substrate is contacted with aqueous solution of a reducing agent and cupric brine solution, so that the surface of the plastic substrate is adhered with the simple substance copper particle layer; and the metal plating layer is formed through metal deposit, and the simple substance copper particle layer and the metal plating layer form the chemical plating layer, wherein the contact condition ensures that the reducing agent reduces cupric salt into simple substance copper particles of which the diameter is between 15 and 100nanometers, and the bonding force between the chemical plating layer and the plastic substrate is between 100 and 400MPa. The method has high production efficiency and low cost; and the chemical plating layer can be firmly bonded with the substrate.

Description

Technical field [0001] The invention relates to an electroless plating material and a method for preparing the above electroless plating material. Background technique [0002] Electroless plating, also known as "electroless plating", is a type of metal ions that are reduced to the surface of a catalytically active substrate through a controllable redox reaction under the action of a reducing agent in the same solution when no current is passed through. Obtain a plating layer that is firmly bonded to the substrate. The electroless plating layer has uniform thickness, few pinholes, does not require DC power equipment, can deposit metal on non-conductors, and has some special properties. Especially, no matter how complicated the plated part is, as long as the solution can penetrate into the place, a uniform thickness of the coating can be obtained, and it is easy to control the thickness of the coating. Usually, before electroless plating is performed on the substrate, the substr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/31
Inventor 陈炎刘倩倩林信平宫清
Owner 安徽新合富力科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap