Chemical plating material and preparation method thereof

Abstract

The invention discloses a chemical plating material, which comprises a plastic substrate and a chemical plating layer, wherein the chemical plating layer comprises a simple substance copper particle layer and a metal plating layer; the simple substance copper particle layer is positioned between the plastic substrate and the metal plating layer; the particle diameter of simple substance copper particles is between 15 and 100 nanometers; and the bonding force between the chemical plating layer and the plastic substrate is between 100 and 400MPa. The invention also discloses a preparation methodfor the chemical plating material, which comprises that: the plastic substrate is contacted with aqueous solution of a reducing agent and cupric brine solution, so that the surface of the plastic substrate is adhered with the simple substance copper particle layer; and the metal plating layer is formed through metal deposit, and the simple substance copper particle layer and the metal plating layer form the chemical plating layer, wherein the contact condition ensures that the reducing agent reduces cupric salt into simple substance copper particles of which the diameter is between 15 and 100nanometers, and the bonding force between the chemical plating layer and the plastic substrate is between 100 and 400MPa. The method has high production efficiency and low cost; and the chemical plating layer can be firmly bonded with the substrate.

Description

Technical field [0001] The invention relates to an electroless plating material and a method for preparing the above electroless plating material. Background technique [0002] Electroless plating, also known as "electroless plating", is a type of metal ions that are reduced to the surface of a catalytically active substrate through a controllable redox reaction under the action of a reducing agent in the same solution when no current is passed through. Obtain a plating layer that is firmly bonded to the substrate. The electroless plating layer has uniform thickness, few pinholes, does not require DC power equipment, can deposit metal on non-conductors, and has some special properties. Especially, no matter how complicated the plated part is, as long as the solution can penetrate into the place, a uniform thickness of the coating can be obtained, and it is easy to control the thickness of the coating. Usually, before electroless plating is performed on the substrate, the substr...

AI Technical Summary

Problems solved by technology

The activation process uses a powdered substrate for chemical activation to enhance its catalytic activity. Although the interference of tin ions is avoided, the selectivity of this method is very low when the substrate is selectively electroless plated, and the deposition time is long. Usually For 24 hours or even longer, and the bonding force between the metal coating deposited on the substrate and the substrate is not strong, the chemical coating is easy to fall off from the surface of the substrate, and the qualification rate of the coating is low

In addition, in the past 20 years, the prices of various precious metals have soared, and the cost of electroless plating activation with Pd, Rh, Ru or Ag is relatively high. The trend of replacing these precious metals with other cheap materials has become irresistible.