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Chemical plating material and preparation method thereof

A technology of chemical plating and chemical plating, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of weak bonding between metal plating and substrate, chemical plating falling off, and low qualified rate of plating, etc. To achieve the effect of short cycle, high production efficiency and simple operation

Inactive Publication Date: 2011-03-30
安徽新合富力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The activation process uses a powdered substrate for chemical activation to enhance its catalytic activity. Although the interference of tin ions is avoided, the selectivity of this method is very low when the substrate is selectively electroless plated, and the deposition time is long. Usually For 24 hours or even longer, and the bonding force between the metal coating deposited on the substrate and the substrate is not strong, the chemical coating is easy to fall off from the surface of the substrate, and the qualification rate of the coating is low
In addition, in the past 20 years, the prices of various precious metals have soared, and the cost of electroless plating activation with Pd, Rh, Ru or Ag is relatively high. The trend of replacing these precious metals with other cheap materials has become irresistible.

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0017] According to the preparation method of the electroless plating material of the present invention, wherein, the method comprises contacting the plastic substrate with the reducing agent aqueous solution and the divalent copper salt solution, so that the surface of the plastic substrate is attached with a layer of simple copper particles, and then metal deposition is performed to form a metal coating , the elemental copper particle layer and the metal coating constitute an electroless coating, the conditions of the contact make the reducing agent reduce the divalent copper salt to an elemental copper particle with a particle diameter of 15-100 nanometers, and the electroless coating and The binding force between the plastic substrates is 100-400 MPa. The method of contacting the plastic substrate with the reducing agent aqueous solution and the divalent copper salt solution may be to add the divalent copper salt solution to the reducing agent aqueous solution after the pla...

reference example 1

[0033] Put 1000 pieces of 3 cm × 3 cm ABS engineering plastic substrates (4 grams) of the C2950 model produced by Dongguan Tongxin Engineering Plastics Co., Ltd. into 1 mol / liter of NaOH, 1 mol / liter of NaOH 2 CO 3 and 0.1 mol / L sodium dodecylsulfonate solution, soak for 10 minutes at 50°C, rinse twice with deionized water after taking it out; then soak in 1 mol / L phosphoric acid solution for 10 minutes , rinse twice with deionized water after taking it out; then put in 1 mol / L H 2 SO 4 , 4 mol / L CrO 3 and 0.02 mol / L CrCl 3 ·6H 2 O solution, soak at 70°C for 12 minutes, take it out and rinse it twice with deionized water.

Embodiment 1

[0035] This embodiment is used to illustrate the electroless plating material provided by the present invention and its preparation method.

[0036] (1) Prepare the electroless plating activation solution: add 0.014 mole of glucose to 50 ml of water, record it as solution A, and keep the temperature in a water bath at 80°C. In 200 milliliters of water, add 0.024 moles of copper sulfate and potassium sodium tartrate of 400% by weight relative to the weight of copper sulfate, and adjust the pH of the solution with sodium hydroxide to be 12, which is designated as solution B, and kept at a constant temperature in a water bath at 80°C;

[0037] (2) Electroless plating activation: put 10 pieces of ABS plastic substrates derived from Reference Example 1 into the above-mentioned solution B at 80°C, and then put the above-mentioned solution A at 0.72×10 per second -5 Add the solution B dropwise at a molar rate, and continue to contact for 10 minutes after the dropwise addition, then t...

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PUM

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Abstract

The invention discloses a chemical plating material, which comprises a plastic substrate and a chemical plating layer, wherein the chemical plating layer comprises a simple substance copper particle layer and a metal plating layer; the simple substance copper particle layer is positioned between the plastic substrate and the metal plating layer; the particle diameter of simple substance copper particles is between 15 and 100 nanometers; and the bonding force between the chemical plating layer and the plastic substrate is between 100 and 400MPa. The invention also discloses a preparation method for the chemical plating material, which comprises that: the plastic substrate is contacted with aqueous solution of a reducing agent and cupric brine solution, so that the surface of the plastic substrate is adhered with the simple substance copper particle layer; and the metal plating layer is formed through metal deposit, and the simple substance copper particle layer and the metal plating layer form the chemical plating layer, wherein the contact condition ensures that the reducing agent reduces cupric salt into simple substance copper particles of which the diameter is between 15 and 100 nanometers, and the bonding force between the chemical plating layer and the plastic substrate is between 100 and 400MPa. The method has high production efficiency and low cost; and the chemical plating layer can be firmly bonded with the substrate.

Description

technical field [0001] The invention relates to an electroless plating material and a method for preparing the above electroless plating material. Background technique [0002] Electroless plating, also known as "electroless plating", is a method in which metal ions are reduced on the surface of a catalytically active substrate through a controllable oxidation-reduction reaction under the action of a reducing agent in the same solution when no current passes, thereby A coating that is firmly bonded to the substrate is obtained. Electroless plating has uniform coating thickness, less pinholes, and has the characteristics of not requiring DC power supply equipment, being able to deposit metal on non-conductors, and having some special properties. Especially no matter how complicated the plated piece is, as long as the solution can penetrate, a uniform thickness of the plated layer can be obtained, and the thickness of the plated layer is also easy to control. Usually, before...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/16C23C18/31
Inventor 陈炎刘倩倩林信平宫清
Owner 安徽新合富力科技有限公司
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