Multilayer interconnection structure of wafer level package, manufacturing method and application
A technology of wafer-level packaging and multilayer interconnection, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as large parasitic effects and large losses, and reduce parasitic effects and losses, reduce Loss, the effect of increasing packing density and production efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0032] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings to fully embody the advantages and positive effects of the present invention. The scope of the present invention is not limited to the following embodiments.
[0033] Such as figure 2 Shown is a microwave multi-chip module wafer-level package structure according to an embodiment of the present invention. The multi-layer interconnection structure 120 based on the silicon substrate 101 is embedded with a transmission line 104 for interconnection, a ground layer 102, and various passive components, such as a capacitor 103, a resistor 105, an inductor 106, and a miniature antenna 107. The metal interconnections (such as the transmission lines 104 and the vertical interconnect vias 108) and the passive components in the multilayer interconnection structure are realized by a low-cost electroplating process. The thickness of the metal is generally 1 to ...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap