Multilayer interconnection structure of wafer level package, manufacturing method and application

Abstract

The invention provides a multilayer interconnection structure of wafer level package, a manufacturing method and application thereof. The multilayer interconnection structure is used for microwave multi chip modules. The invention is characterized by using benzocyclobutene (BCB) as a dielectric layer, realizing the multilayer connection structure of a metal / organic polymer by combining wafer levelprocessing technics such as photoetching, electroplating, mechanical polishing and the like and embedding integrated varied passive devices and transmission lines for interconnection. The whole process is matched with IC process, is completed on the basis of wafer level and has higher integration of packaging and lower high-frequency transmission loss. The structure can effectively integrate varied function device units, reduce the interconnection loss among the devices and improve the properties of the whole module while improving the density and integration of packaging and reducing the cost of packaging.

Description

technical field [0001] The invention relates to a multi-layer interconnection structure, preparation method and application for microwave multi-chip module (Microwave Multi Chip Module, abbreviated as MMCM) wafer-level packaging. In particular, it relates to multilayer three-dimensional packaging structures including micromachining techniques such as mechanical polishing. Background technique [0002] Multi-chip module (Multi Chip Module, abbreviated as MCM), refers to the integration of multiple bare or / and packaged integrated circuit chips and single or multiple passive components, such as resistors, capacitors, inductors, etc., into a package substrate A technique on which a system or functional module is formed, figure 1 Shown is a schematic dissection diagram of a traditional MCM. Chips and components are mounted on a substrate, and the interconnection between the chip and the substrate or the chip and other devices is realized by wire bonding. Microwave Multi Chip Mo...

AI Technical Summary

Problems solved by technology

Active circuit chips such as MMIC usually realize the electrical interconnection between the chip and the substrate circuit through a wire bonding connection. The disadvantage of the wire bonding connection is that it introduces a large parasitic effect and has a large loss under high frequency conditions.

The thicker dielectric layer makes the packaging density and efficiency of the current MMCM module need to be further improved

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