High-temperature baking resistant phenolic molding compound and preparation method thereof

A technology of phenolic molding compound and high temperature resistance, applied in the field of phenolic molding compound and its preparation, can solve the problems of reducing the thermal stability of phenolic resin and affecting the baking resistance of bakelite products, and achieve the effect of cost increase

Active Publication Date: 2010-03-10
上海欧亚合成材料股份有限公司
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The addition of wood powder reduces the thermal stability of phenolic resin on the one hand, and on the other hand, secondary

Method used

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  • High-temperature baking resistant phenolic molding compound and preparation method thereof
  • High-temperature baking resistant phenolic molding compound and preparation method thereof

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Embodiment Construction

[0024] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further explained below in conjunction with specific drawings.

[0025] The present invention discloses a high-temperature baking resistant phenolic molding compound, which contains additives and further includes the following components: (1) phenolic resin with a content of 30 to 48%; (2) wood flour with a content of 10 to 40%; 3) Mineral filler, the content is 10-30%; (4) Urotropine curing agent, the content is 4.0-9.0%; (5) Phosphoric anhydride catalyst, the content is 0.5-5.0%; (6) Acrylate nanoparticles Or silicone rubber nanoparticles, the content is 0.5-5.0%. The additives include pigments, lubricants, flame retardants, mold release agents, etc., which are well-known technologies in the field of the present invention.

[0026] The present invention uses phenolic resin as a binder. The phenolic resin used is an aci...

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Abstract

The invention provides a high-temperature baking resistant phenolic molding compound containing additive, which comprises the following components by weight percent: 30-48% of phenolic resin; (2) 10-40% of wood powder; (3) 10-30% of mineral filler; (4) 4.0-9.0% of hexamine; (5) 0.5-5.0% of phosphoric anhydride and (6) 0.5-5.0% of acrylic ester nano particles or silicon rubber nano particles. The invention also discloses a method for preparing the high-temperature baking resistant phenolic molding compound. The phenolic molding compound can be baked for 2h at the temperature of 250 DEG C, and does not crack, foam or deform; and compared with the common bakelite, the cost of the invention is not obviously increased.

Description

Technical field [0001] The invention relates to a high temperature resistant engineering material and a preparation method thereof, in particular to a high temperature baking resistant phenolic molding compound and a preparation method thereof. Background technique [0002] Phenolic molding compound, also known as bakelite powder and bakelite powder, is a widely used thermosetting plastic composed of phenolic resin, filler, plasticizer, lubricant and curing agent in a certain proportion. The content of phenolic resin is generally 35%-65%, and the filler is generally wood flour, asbestos, mica, kaolin, nylon or glass fiber. [0003] Phenolic molding compound is a hard and brittle thermosetting plastic with a density of 1.5% to 2.0g / cm3. It has high mechanical strength, toughness and wear resistance, stable size, corrosion resistance, and excellent electrical insulation performance. It is suitable for the production of insulating parts for electrical appliances and meters, and can b...

Claims

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Application Information

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IPC IPC(8): C08L61/06C08L97/02C08L33/08C08L83/04C08K13/02C08K13/04C08K3/32C08K5/3492
Inventor 杨小云杨玮朱永茂
Owner 上海欧亚合成材料股份有限公司
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