High-efficiency insulating material used for high-temperature pipeline and preparation method thereof

A heat insulation material and pipeline technology, applied in pipeline protection, heat exchange equipment, pipeline protection through heat insulation, etc., to achieve the effect of reducing the proportion of solid heat conduction

Active Publication Date: 2010-03-17
NAVAL UNIV OF ENG PLA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to address the use environment and technical requirements of high-temperature pipelines, overcome the shortcomings of supercritical drying required for the preparation of airgel-based materials by the sol-gel method, and provide a safe preparation process, simple process, non-toxic and harmless, and stable material performance. High-efficiency thermal insulation material for high temperature pipeline and preparation method thereof

Method used

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  • High-efficiency insulating material used for high-temperature pipeline and preparation method thereof
  • High-efficiency insulating material used for high-temperature pipeline and preparation method thereof
  • High-efficiency insulating material used for high-temperature pipeline and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Using a specific surface area of ​​200m 2 / g nano-SiO 2 60wt% of powder, 35wt% of zircon powder with a particle size range of 0.39-13.98μm and a median particle size of 2.216μm, 5wt% of alkali-free ultrafine glass fibers with a diameter of 1-10μm and a length of 1-5mm, at a speed of 2400rpm Blend on high speed blender for 5 minutes. Placed in a steel mold of 210×110×75mm, and dry-pressed under a pressure of 2MPa to form a sample with a thickness of about 30mm (sample K in Table 2). The molded body is elastic when pressed, and its bulk density is measured to be 424kg / m 3 , The thermal conductivity at room temperature is 0.036W / (m·K), and the average thermal conductivity at 500°C is 0.053W / (m·K). nano-SiO2 After adding zircon into the matrix, the high temperature thermal conductivity is reduced to half of that of sample A without opacifying agent in the comparative example. Its thermal conductivity at 500°C is less than that of still air at 500°C.

Embodiment 2

[0035] The zircon powder was replaced by SiC powder with a particle size range of 1.29-5.97 μm and a median particle size of 3.029 μm, and the others remained unchanged. The molded body (sample D in Table 2) is elastic when pressed, and its bulk density is measured to be 412kg / m 3 , the thermal conductivity at room temperature is 0.039W / (m·K), and the average thermal conductivity at 500°C is 0.048W / (m·K). Its thermal conductivity at 500°C is less than that of still air at 500°C.

[0036] Table 2 Nano-SiO 2 / Opacifier / Fiber composite material thermal conductivity measurement results

[0037] (Shanghai Institute of Ceramics, Chinese Academy of Sciences)

[0038]

Embodiment 3

[0040] In the comparative example, 10wt%, 25wt%, and 35wt% of SiC powder with a particle size range of 1.29-5.97μm and a median particle size of 3.029μm were added respectively, and the same fiber 5wt% was kept, and the specific surface area was adjusted to 200m 2 / g nano-SiO 2 The amount of powder added to the total amount is 100%. Mix for 5 minutes in a high-speed mixer with a rotation speed of 2400 rpm. Placed in a steel mold of 210×110×75mm, and dry-pressed under a pressure of 2MPa to form a sample with a thickness of about 30mm. The molded body is elastic when pressed, and its properties are measured as follows:

[0041] Sample B-10wt% SiC addition, bulk density 308kg / m 3 , the thermal conductivity at room temperature is 0.036W / (m K), and the average thermal conductivity at 500°C is 0.048W / (m K);

[0042] Sample C-25wt% SiC addition, bulk density 346kg / m 3 , the thermal conductivity at room temperature is 0.034W / (m K), and the average thermal conductivity at 500°C is...

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Abstract

The invention discloses a high-efficiency insulating material capable of being used for a high-temperature pipeline with insulation requirements. The high-efficiency insulating material comprises thefollowing mixed raw materials by weight percentage: 40 to 80 percent of nano SiO2 powder, 5 to 40 percent of infrared opacifier and 0 to 25 percent of reinforcing fiber. The high-efficiency insulatingmaterial is formed by adopting a drying method and overcomes the defect that the sol-gel method for preparing an aerogel-based material needs supercritical drying. The high-efficiency insulating material is designed by a microstructure, carries out full restriction on heat conduction, convection and radiant heat transfer at high temperature simultaneously and leads the heat-conducting coefficientof material under the use temperature to be lower than that of static air.

Description

technical field [0001] The invention belongs to the field of thermal insulation materials, in particular to a high-efficiency thermal insulation material for high-temperature pipelines and a preparation method thereof. Background technique [0002] At present, the heat insulation materials for high-temperature pipelines above 500°C mainly include: ①aluminum silicate fiber and its products; ②rock wool, slag wool and its products; ③glass wool products (alkali-free ultra-fine glass wool); ④expanded vermiculite and its composite materials; ⑤ asbestos products (foamed asbestos). For a long time, during the use of the above-mentioned thermal insulation materials, a large number of problems and defects have been exposed, mainly including: [0003] 1) Poor thermal insulation performance: the thermal conductivity at room temperature is 0.06-0.2W / m·K, and it rises rapidly with the use temperature. For example, the thermal conductivity of high-quality glass wool blanket is 0.13W / m·K a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B30/02F16L59/02
Inventor 杨自春陈德平陈林根杨毅陈俊
Owner NAVAL UNIV OF ENG PLA
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