Process for degumming and pre-cleaning silicon slices

Abstract

The invention discloses a process for degumming and pre-cleaning silicon slices, which can prevent silicon slices from cracking, lead the surfaces of the silicon slices to be not dried easily, reduce the discharge of sewage to an extreme extent and decrease production cost. The process comprising the following steps: placing the silicon slices bonded with AB gel in silicon rod cutting solution, heating the cutting solution to 70-90 DEG C, matching ultrasonic wave with 5-8 watt power density in per liter of silicon rod cutting solution, cleaning for 3-5 minutes, and degumming the AB gel on the silicon slices. The process adopts the silicon rod cutting solution matching with the ultrasonic wave with a certain power density to lead the silicon slices to degum, thus not only ensuring no generation of debris and the surface quality of the silicon slices, but also completely degumming the AB gel on the silicon slices; furthermore, the surfaces of the silicon slices are not easy to dry, thus being beneficial to subsequent cleaning and the making herbs and wools. In addition, the silicon rod cutting solution can be recycled, thus leading the degumming process to be environment-friendly, and also greatly reducing the processing cost.

Description

technical field [0001] The invention relates to a silicon chip used for solar power generation, in particular to a degumming pre-cleaning process for the silicon chip. Background technique [0002] As we all know, using solar energy to generate electricity is the direction of developing clean energy in the world today, and silicon wafers are the core material for absorbing and transmitting solar energy. [0003] Wafers are cut from silicon rods, see figure 1 , figure 2 As shown, the cutting process is: glue the silicon rod 3 on the frosted glass 2 with AB glue, the frosted glass 2 and the wire cutting template 1 are also glued with AB glue, and then use a special cutting device to cut the silicon rod into 0.18mm Silicon wafers left and right. The cut silicon wafers need to be degummed, pre-cleaned and subsequently cleaned, and finally the surface of the silicon wafers is textured. Whether the degumming is thorough directly affects the subsequent cleaning and texture qua...

AI Technical Summary

Problems solved by technology

The disadvantage of this degumming method is: due to the certain pressure of the hot water spray, it is easy to cause fragments on the silicon wafer, which affects the quality of the silicon waf

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