Manufacturing method of gallium arsenide/gallium antimonide solar battery
A technology of solar cells and manufacturing methods, which is applied in the manufacture of circuits, electrical components, and final products, can solve the problems of high power ratio per unit weight and high cost, and achieve the effects of long life, large absorption coefficient, and strong radiation resistance
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[0016] Including the following steps:
[0017] (1) Put the no-clean N + -GaAs single wafer substrate is placed on the sample holder of a molecular beam epitaxy (MBE) growth chamber, deoxidizes at a high temperature at 580℃, and the temperature of the GaAs substrate is increased to 630℃ for high temperature degassing, and then the substrate temperature is reduced to 580 ℃, open the shutters of Ga and As source furnaces to do doped n + -GaAs buffer layer growth, doping concentration is n + 3~5×10 18 ; Molecular beam epitaxial growth chamber at n + The GaAs layer is in a vacuum state before growth, and the pressure is 5×10 -9 mbar; molecular beam epitaxial growth chamber at n + During the growth of the GaAs buffer layer, the pressure of the molecular beam epitaxial growth chamber is 5~8×10 -8 mbar; n + The growth thickness of the GaAs buffer layer is 500 nm.
[0018] (2) Close the shutter of the Ga and As source furnace, lower the temperature of the single wafer substrate to 450°C, ope...
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