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Process for producing printed wiring board and printed wiring board produced by the production process

A technology for printed wiring substrates and manufacturing methods, applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of copper wiring short circuit, high insulation resistance, etc., and achieve high insulation reliability and great effect

Active Publication Date: 2010-06-02
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009]However, when the above-mentioned two-layer plated substrate is etched using the above-mentioned etching solution, there is a case where etching residues are generated on the base metal layer such as Ni-Cr alloy Next, if the above-mentioned constant temperature and humidity bias test (HHBT) is carried out, there is a problem that the adjacent copper wiring is short-circuited by the etching residue of the above-mentioned Ni-Cr alloy layer, and high insulation resistance cannot be obtained, resulting in a problem that it becomes a defective product.

Method used

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  • Process for producing printed wiring board and printed wiring board produced by the production process
  • Process for producing printed wiring board and printed wiring board produced by the production process
  • Process for producing printed wiring board and printed wiring board produced by the production process

Examples

Experimental program
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Effect test

Embodiment 1～6、 comparative example 1～6

[0093] Hereinafter, examples and comparative examples of the present invention will be described in more detail.

[0094] The Ni-Cr alloy film in embodiment 1~6, comparative example 1~6 is to use 20% by weight Cr-Ni alloy target (Sumitomo Metal Mining Co., Ltd.) was formed with a thickness of 20 to 30 nm by a direct current sputtering method (sputtering device: manufactured by Hirano Koson Co., Ltd.).

[0095] In addition, the copper films in Examples 1 to 6 and Comparative Examples 1 to 6 were formed on the polyimide film in the range of 100 to 120 nm by the DC sputtering method.

[0096] In each of the Examples and Comparative Examples, a predetermined alloy film, metal film, or copper film was individually formed on the polyimide film, and used to evaluate the dissolution of the alloy film, metal film, or copper film respectively. characteristic.

[0097] Potassium permanganate was dissolved in ion-exchanged water with the composition shown in the table below to prepare a...

Embodiment 7

[0109] A polyimide film (manufactured by Toray-DuPont Co., film thickness 50 μm) was cut out to a size of 12 cm×12 cm, and a 7% by weight Cr-Ni alloy target (manufactured by Sumitomo Metal Mining) was used on one side, and was sputtered by direct current A 7% by weight Cr—Ni alloy metal film was formed with a thickness of 20 to 30 nm using a sputtering apparatus: manufactured by Hirano Koson Co., Ltd. An evaluation sample of 50 mm x 50 mm was cut out from the obtained polyimide film forming an alloy film, and was heated at 40° C. After dipping for 2 minutes, the degree of dissolution of the alloy film was visually confirmed, and the dissolution of the alloy film was observed.

Embodiment 8

[0111] In the same manner as in Example 7, a 30 wt% Cr-Ni alloy metal film was formed by the DC sputtering method using a 30 wt% Cr-Ni alloy target (manufactured by Sumitomo Metal Mining Co., Ltd.). An evaluation sample of 50 mm x 50 mm was cut out from the obtained polyimide film forming an alloy film, and was heated at 40° C. After dipping for 2 minutes, the degree of dissolution of the alloy film was visually confirmed, and the dissolution of the alloy film was observed.

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Abstract

The object of the invention is to provide a process for producing a printed wiring board, which can remove a residual metal among wirings at a low cost in a simple process without side etching of a copper layer and can realize satisfactory insulation reliability even in the case of a micro wiring product, and a printed wiring board produced by the production process. A process for producing a printed wiring board, comprising forming a pattern by etching of a two-layer flexible substrate comprising an insulator film, a substrate metal layer provided directly on at least one side of the insulator film without through any adhesive and a copper film layer provided on the substrate metal layer, characterized in that the etching is carried out by a method comprising the step of etching the two-layer flexible substrate by a ferric chloride solution or a hydrochloric acid-containing cupric chloride solution, and the step of then treating the two-layer flexible substrate with an acidic oxidizing agent containing a permanganate.

Description

technical field [0001] The present invention relates to a method of manufacturing a printed wiring board as a raw material of electronic parts such as TAB tape and COF tape, and a printed wiring board obtained by the manufacturing method. More specifically, it relates to a two-layer flexible substrate by performing predetermined etching, In an inexpensive and simple process, metal residues between wirings can be removed without side etching of the copper layer, and a printed wiring board manufacturing method that can form a pattern with sufficient insulation reliability even in fine wiring processed products, and by A printed wiring board obtained by this manufacturing method. Background technique [0002] In general, substrates used for producing flexible wiring boards are roughly classified into three-layer flexible substrates in which copper foil as a conductor layer is bonded to an insulator film with an adhesive (for example, refer to Patent Document 1), and in this A ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06C23F1/18C23F1/26C23F1/28C23F1/30
CPCH05K1/0393H05K3/067H05K3/388H05K2203/0796C23F1/28H05K3/26H05K2201/0761C23F1/26Y10T428/12569Y10T428/31681C23F1/18H05K3/06
Inventor 永尾晴美浅川吉幸
Owner SUMITOMO METAL MINING CO LTD
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