Wafer reduction type powerless chemical gilding method

Abstract

The invention provides a wafer reduction type powerless chemical gilding method. The method includes the following steps: a wafer is immersed into an organic solvent trough to dissolve organisms and is then immersed into a water washing trough for cleaning; plasma surface treatment is carried out on the wafer after water is removed so as to remove the residual organic substances; the wafer is immersed into a pre-immersion wetting trough to increase the surface wetting degree and is then immersed into a chemical gilding trough for reduction reaction; gold is deposited on the surface of the wafer to form a metal layer; finally, the wafer is immersed into the water washing trough for cleaning and the water is removed again, so as to form the metal layer which is uniformly distributed and hascertain thickness as well as high roughness, thereby ensuring the quality and excellent rate of the metal layer. Moreover, the adhesive force when in routing, welding or wafer coating encapsulation can be effectively enhanced, and the metal layer or an electrode junction point with specified part, zone range and shape can be manufactured; what is more, materials can be saved and the manufacturingcost can be reduced as well.

Description

technical field [0001] The invention relates to a reduction type electroless chemical gold plating method for wafers, in particular to a gold plating method for depositing and forming a metal layer by performing a reduction reaction on the surface of a wafer by means of electroless plating. Background technique [0002] In recent years, due to the vigorous development of high-tech today, many high-tech products have excellent functions. Whether in work or in daily life, high-tech products can provide users with fast and convenient use of products, and also lead people to enjoy The comfortable life brought by high-tech products, as well as the energy saving, recyclability and reduction of harm and pollution to the human body and the environment, which are emphasized by green design, are important topics in the current globalized society. [0003] Light Emitted Diodes (LEDs) are generally installed in lighting equipment. In addition to their advantages of small size, long lif...

AI Technical Summary

Problems solved by technology

Since the metal layer is deposited by evaporation or sputtering, this method can not only deposit the metal material to be deposited on the object to be deposited during processing, but also deposit it in the vacuum of the evaporation or sputtering equipment. On the inner wall of the cavity, it will cause unnecessary waste of the target material, resulting in an increase in the overall manufacturing cost. In more serious cases, the cleanliness of the vacuum cavity will be greatly reduced, which will affect the quality and good rate of the deposited metal layer.

[0005] Therefore, the above-mentioned prior art adopts the deposition of the metal layer on the object to be plated by evaporation or sputtering, resulting in many problems and problems in use. lack, and still need to be further improved, which is the direction that the inventor and those engaged in this industry want to improve urgently

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