Preparation method for silicon-based solar energy thin film
A solar thin-film, silicon-based technology with applications in chemical instruments and methods, final product manufacturing, sustainable manufacturing/processing, etc.
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Embodiment 1
[0032] Step 1: Put 4-5N silicon wafers into the substrate fixture; put 150Kg of In as a solvent into the graphite crucible; vacuumize the furnace chamber and introduce inert gas, and turn off the vacuum pump at the same time to maintain a slight positive pressure.
[0033] Step 2: heat up to the melting point of In above 200°C, after melting In, put the substrate holder loaded with the silicon wafer into the In melt;
[0034] Step 3: Gradually raise the temperature to 900°C to dissolve the silicon wafer; control the temperature and time to melt the required thickness of the silicon wafer;
[0035] Step 4: Lower the temperature by 0.2-1°C / h, the silicon in the melt is precipitated, and re-grows on the substrate silicon wafer; after 10-20 hours, slowly lift the substrate holder out of the liquid surface, and take out the silicon wafer after cooling.
Embodiment 2
[0037] Step 1: Put 4-5N silicon wafers into the substrate fixture; put 200Kg of In as a solvent into the graphite crucible; vacuumize the furnace chamber and introduce inert gas, and turn off the vacuum pump at the same time to maintain a slight positive pressure.
[0038] Step 2: heat up to the melting point of In above 300°C, melt the In, and put the substrate holder loaded with the silicon wafer into the In melt;
[0039] Step 3: Gradually raise the temperature to 900°C to dissolve the silicon wafer; control the temperature and time to melt the required thickness of the silicon wafer;
[0040] Step 4: Lower the temperature by 0.2-1°C / h, the silicon in the melt is precipitated, and re-grows on the substrate silicon wafer; after 10-20 hours, slowly lift the substrate holder out of the liquid surface, and take out the silicon wafer after cooling.
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