Growth method for obtaining high aluminium component Al-Ga-N alloys by improving aluminium doping efficiency
A growth method and technology of aluminum gallium nitride, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effects of excellent quality, suppression of surface cracks, and excellent luminous performance
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[0022] The technical solution of the present invention is to use MOCVD in α-Al 2 O 3 The AlGaN alloy film is epitaxially grown on the substrate, with metal organic sources TMAl and TMGa as the III source, NH 3 As a source of V family, H 2 As a carrier gas:
[0023] Use AlN as the buffer layer. The growth temperature of the AlN buffer layer is 600 to 1000°C, and the growth thickness is from 10 to 100 nm. After the growth of the AlN buffer layer is completed, the temperature of the reaction chamber is increased to 1100-1150°C to continue growing Al x Ga 1-x N alloy film layer;
[0024] Or use thick GaN as the support layer, first grow a layer of GaN on the substrate as the support layer, the thickness of the GaN support layer is 2-5μm, the growth temperature is 1050°C, and then the MOCVD reaction chamber temperature is set to 700 to 1000°C, Grow an AlN insertion layer with a thickness of 10-100nm. After the AlN insertion layer has grown, increase the temperature to 1100-1150℃ to grow ...
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