Crystalline silicon solar battery selective diffusion process
A technology of solar cell and diffusion process, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of staying at the laboratory level, adverse effects of silicon wafer performance, and cumbersome mass production process, and achieve good short-wave response and low production cost. The effect of low cost and simple process operation
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Embodiment 1
[0019] Put the cleaned and textured silicon wafers in a tube-type diffusion furnace for high-temperature concentrated phosphorus diffusion. After diffusion, the square resistance is 30 ohms; Print the corrosive paste containing 20% concentration of ammonia hydrogen fluoride on the non-electrode grid line area to etch it, place the silicon wafer with the printed etching paste in the air at room temperature for 2 minutes, and compare the square resistance of the non-electrode grid line area Corrosion from the original 30 ohms to 80 ohms, the square resistance of the electrode grid line area remains unchanged at 30 ohms, and the corrosion thickness is controlled at 200nm; then the etched silicon wafer is ultrasonically cleaned with deionized water for 5 minutes, and rinsed with deionized water for 10 minutes again ; The cleaned silicon wafer is then subjected to subsequent processes such as etching, anti-reflection coating, electrode printing and sintering to obtain solar cells....
Embodiment 2
[0021] Put the cleaned silicon wafers in a chain-type diffusion furnace for high-temperature concentrated phosphorus diffusion. After diffusion, the square resistance is 40 ohms; Print the corrosive slurry containing 30% concentration of ammonia hydrogen fluoride on the non-electrode grid line area to etch it, and place the silicon wafer with the printed etching slurry in the air at room temperature for 3 minutes, and the square resistance of the non-electrode grid line area From the original 40 ohm corrosion to 100 ohm, the square resistance of the electrode grid line area remains unchanged at 40 ohm, and the corrosion thickness is controlled at 300nm; then the etched silicon wafer is ultrasonically cleaned with deionized water for 3 minutes, and then rinsed with deionized water again 5min; the cleaned silicon wafer is then subjected to subsequent processes such as etching, anti-reflection coating, electrode printing and sintering to obtain solar cells.
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