Washing-free lead-free halogen-free tin soldering paste

A no-cleaning, solder paste technology, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as physical and environmental hazards, failure of electronic product components, etc., and achieve good printing performance

Inactive Publication Date: 2010-07-21
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Halogen-containing solder paste volatilizes halogen-containing fumes during soldering, which will cause harm to the body and the environment, and the fumes will generate halogen acids after absorbing water, which will cause electronic product components to fail

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1: No-cleaning lead-free and halogen-free solder paste is composed of the following substances by weight ratio:

[0042] Lead-free solder powder 89%

[0043] Rosin based solder paste 11%

[0044] Wherein the lead-free solder powder is composed of the following weight ratio substances:

[0045] Tin 96.5%

[0046] Silver 3.0%

[0047] Copper 0.5%.

[0048] Wherein the rosin-based soldering paste is composed of the following weight ratios:

[0049] Succinic Acid 13%

[0050] Diethylene glycol diethyl ether 10%

[0051] Glycerol 12%

[0052] Macrogol 2000 5%

[0053] Paraffin 2%

[0054] Hydrogenated Castor Oil 3%

[0055] Octylphenol ethoxylate 2%

[0056] Triethanolamine 5%

[0057] Lead-Free Rosin 13%

[0058] Polymerized Rosin 35%

[0059] Concrete preparation method comprises the following steps:

[0060] 1. Preparation of lead-free solder powder

[0061] Put tin, silver and copper in the container, stir and mix to become lead-free solder pow...

Embodiment 2

[0065] Embodiment 2: A no-clean lead-free and halogen-free solder paste, including lead-free solder powder with a content of 89% and a rosin-based solder paste with a content of 11%.

[0066] Described lead-free solder powder is identical with embodiment 1.

[0067] Described rosin-based soldering flux is made up of the material of following weight ratio:

[0068] Itaconic acid 4%

[0069] Glutaric Acid 8%

[0070]Propylene Glycol Monomethyl Ether 10%

[0071] Glycerol 12%

[0072] Macrogol 2000 5%

[0073] Hydrogenated Castor Oil 3%

[0074] Octylphenol ethoxylate 2%

[0075] Triethanolamine 5%

[0076] Ethylene bis stearamide 3%

[0077] Water white rosin 23%

[0078] Hydrogenated Rosin 25%

[0079] Concrete preparation method is identical with embodiment 1.

Embodiment 3

[0081] A no-clean lead-free halogen-free solder paste, comprising 89% lead-free solder powder and 11% rosin-based flux.

[0082] Described lead-free solder powder is identical with embodiment 1.

[0083] Described rosin-based soldering flux is made up of the material of following weight ratio:

[0084] Succinic Acid 10%

[0085] Salicylic Acid 5%

[0086] Diethylene glycol monobutyl ether 10%

[0087] Glycerol 12%

[0088] Macrogol 2000 5%

[0089] Paraffin 2%

[0090] Hydrogenated Castor Oil 5%

[0091] Octylphenol ethoxylate 2%

[0092] Triethanolamine 6%

[0093] Fully Hydrogenated Rosin 38%

[0094] Rosin KE-604 15%

[0095] Concrete preparation method is identical with embodiment 1.

[0096] The no-cleaning lead-free and halogen-free solder pastes of the above embodiments are tested according to the standard SJ / T11188, and the indicators are shown in the table below.

[0097] Test items

[0098] Test items

[0099] After testing, the no-cle...

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PUM

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Abstract

The invention discloses a washing-free lead-free halogen-free tin soldering paste, which is formed by mixing 10 to 12.5 percent of colophony-based flux cream and 88 to 89.5 percent of lead-free tin soldering powder, wherein the lead-free tin soldering powder consists of 0 to 3.5 percent of silver, 0.3 to 0.9 percent of copper and tin, the colophony-based flux cream comprises the following components: 2 to 15 percent of organic acid activating agent, 20 to 25 percent of organic solvent, 3 to 5 percent of polyethyleneglycol 2000, 0 to 3 percent of paraffin wax, 3 to 5 percent of hydrogenated castor oil, 2 to 4 percent of surface active agent, 3 to 6 percent of inhibiter, and the rest is modified colophony. The alloy powder is free from containing lead, and the flux cream is free from containing halogen, so the tin soldering paste favors the environment protection, has fewer residues after the soldering, is free from being washed, and has good spreadability of the welding flux. The copper mirror is free from penetration after being welded with the prepared soldering paste. The encapsulation requirement of the top-grade precise electronic product can be satisfied.

Description

technical field [0001] The invention relates to solder paste, in particular to a no-clean lead-free and halogen-free solder paste suitable for precision electronic packaging. Background technique [0002] At present, due to the effective promotion of factors such as environmental protection, lead ban regulations and market competition, the global electronics industry has set off an upsurge in research and development of new lead-free solders to replace traditional tin-lead solders. Among them, Sn-Ag-Cu alloy has become one of the most promising lead-free solders due to its wetting and spreading properties closest to that of tin-lead eutectic solder, good mechanical properties, and easy availability of raw materials. The halogens commonly used in the flux in solder paste are chlorine (Cl), bromine (Br), and fluorine (F). These halogen compounds have strong activity and can enhance the ability of solder paste to remove oxides on the surface of the metal to be welded. . There...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 邱大勇王永吴晶潘建民唐欣
Owner 深圳市唯特偶新材料股份有限公司
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