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Surface mount adhesive for use in lead-free packaging process and preparation method

A packaging technology, lead-free solder technology, applied in the direction of electrical components assembly printed circuit, adhesive, epoxy resin glue, etc., can solve the problems that are difficult to meet high-speed printing and lead-free solder packaging, high soldering temperature, etc., to achieve good Glue dispensing performance, moderate height, and the effect of glue dots not flowing

Inactive Publication Date: 2010-10-20
深圳市唯特偶新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the difficulty in meeting the high-speed printing and high welding temperature of lead-free solder packaging in the existing patch adhesive, and provide a patch adhesive suitable for high-speed dispensing patch and lead-free soldering packaging technology

Method used

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  • Surface mount adhesive for use in lead-free packaging process and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The components of patch adhesive and the content of each part are as follows:

[0028] p-tert-Butylphenyl glycidyl ether 18.4

[0029] Glycidyl tert-carbonate E10P 2.6

[0030] Latent curing agent PN-23 12.3

[0031] Latent curing agent PN-40 6.7

[0032] Fumed silica 7.5

[0033] Red Pigment (Permanent Red) 3

[0034] Light calcium carbonate 10.5

[0035] Microsilica 8.0

[0036] Epoxy resin E51 31

[0037] Specific preparation method:

[0038] Add epoxy resin E51, p-tert-butylphenyl glycidyl ether, glycidyl tert-carbonate E10P, and thixotropic agent (fumed silica) into the planetary power mixer according to the formula ratio and mix and stir for 25 minutes to form a paste Grind for 3 times with a three-roll mill, then add fillers such as light calcium carbonate, silicon micropowder, colorants, latent curing agents PN-23 and PN-40, etc. and stir evenly, then perform vacuum defoaming treatment, and stir for 1 hour After degassing, the patch glue shown is obtain...

Embodiment 2

[0040] Glycidyl tert-carbonate E10P 8.0

[0041] Latent curing agent PN-23 15.3

[0042] MY-24 3.2

[0043] Fumed silica 10.0

[0044] Red Pigment (Permanent Red) 2.0

[0045] Light calcium carbonate 15.0

[0046] Epoxy resin E51 38

[0047] Phenolic epoxy resin DEN438 8.5

[0048] Specific preparation method:

[0049] Add epoxy resin E51, phenolic epoxy resin DEN-438, glycidyl tertiary carbonic acid ester E10P, thixotropic agent (gas phase silica) into the planetary power mixer according to the formula ratio and mix for 25 minutes to form a paste , grind 3 times with a three-roll mill, then add filler light calcium carbonate, colorant, latent curing agent PN-23, MY 24, etc. and stir evenly, then perform vacuum defoaming treatment, stir for 1 hour to degas, and get Adhesives shown.

Embodiment 3

[0051] Thinner Heloxy48 9.0

[0052] Glycidyl tert-carbonate E10P 6.5

[0053] Latent curing agent PN-40 14.0

[0054] MY-24 25

[0055] Fumed silica 4.5

[0056] Red pigment (permanent red) 2.8

[0057] Silica powder 23.9

[0058] Epoxy resin E51 25.6

[0059] Epoxy resin E54 11.2

[0060] Specific preparation method:

[0061] Add epoxy resin E51 and E54 in the planetary dynamic mixer according to the formula ratio, glycidyl tertiary carbonic acid ester E10P, diluent Heloxy 48, thixotropic agent (fumed silica) and mix and stir for 25min to form a paste, use Grind three times with a three-roll mill, then add filler silica powder, colorant, latent curing agent PN-40, MY-24, etc. and stir evenly, then perform vacuum defoaming treatment, stir for 1 hour to degas, and the paste shown in the figure is obtained Sheet glue.

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Abstract

The invention provides a surface mount adhesive for use in a lead-free packaging process and a preparation method and belongs to the field of connecting materials for electronic packaging. The surface mount adhesive comprises the following materials in percentage by mass: 8 to 21 percent of diluent, 14 to 19 percent of curing agent, 4 to 10 percent of thixotropic agent, 2 to 3 percent of pigment, 15 to 30 percent of filler, and the balance of epoxy resin. The preparation method comprises: adding the epoxy resin, the diluent and the thixotropic agent into a planetary-powered mixer in a formula ratio, mixing the mixture and stirring the mixture to make a paste material; grinding the paste by using a three-roller grinding machine for three times; adding the filler, the pigment, the curing agent and the like, and stirring the mixture uniformly; and performing vacuum bubble removal treatment to obtain the surface mount adhesive. The surface mount adhesive of the invention is used for adhesion elements in surface packaging, has high adhesive performance, high temperature resistance, high electrical performance and short curing period. The preparation method is simple. The surface mount adhesive adapts to the temperature of high-speed point surface mount adhesive and lead-free solder packaging soldering process and can satisfy the needs for surface mount adhesives used for packaging high-end electronic products.

Description

technical field [0001] The invention belongs to the field of connecting materials for electronic packaging, and in particular relates to a patch adhesive, which is especially suitable for high-speed dispensing patch and lead-free solder package brazing process temperature. Background technique [0002] In the surface assembly process of the printed circuit board, the role of the patch adhesive is to bond and position the components before wave soldering or reflow soldering, so as to prevent the printed board from appearing due to acceleration, vibration, impact, etc. during the transmission process. The device shifts or falls off, keeping the component in the position it was in when it was printed. After soldering, although the colloid still remains on the substrate, it no longer plays the role of bonding, but the solder replaces the fixing element and provides a reliable electronic connection. [0003] In recent years, on the one hand, the development of packaging technolo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J163/00C09J163/02H05K3/34
Inventor 廖高兵吴晶李珂王永唐欣邱大勇雷永平林健符寒光吴中伟
Owner 深圳市唯特偶新材料股份有限公司
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