Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED backlight integration and encapsulation structure and encapsulation method

A technology of LED backlight and integrated packaging, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of affecting the life of LED, high price, large LED light decay, etc., to save electrode materials, reduce packaging costs, The effect of reducing energy consumption

Inactive Publication Date: 2011-06-29
SHAANXI UNIV OF SCI & TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 3). At present, in the application of LED backlight, heat dissipation is a problem to be solved, especially for large-size screen displays. The increased cost of heat dissipation and the high price are an important problem to be faced.
Heat dissipation will affect the life of the LED, making the LED light decay greatly

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED backlight integration and encapsulation structure and encapsulation method
  • LED backlight integration and encapsulation structure and encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The structural principle and working principle of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0029] See attached figure 1 As shown, the LED backlight integrated packaging structure includes a substrate 1 and a reflective layer 6 provided on the substrate 1, and a light guide diffusion plate 7 and a prism are sequentially arranged above the substrate 1 provided with the reflective layer 6 from bottom to top. Board 8, wherein: LED blue light dies 2 are distributed in an array on the substrate 1, and the LED blue light dies 2 are distributed in a square, square, triangular, quadrilateral, hexagonal or five-pointed star geometric array; The periphery of the LED blue light tube core 2 is coated with a yellow light phosphor and an epoxy resin layer 5; the light guide diffusion plate 7 is a light-transmitting material with a high refractive index, and the light-transmitting material with a high refractive in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an LED backlight integrating encapsulation structure and encapsulation method. The encapsulation structure comprises a substrate (1) and a reflecting layer (6) arranged on the substrate (1), wherein a light-guiding diffusion plate (7) and a prism plate (8) are arranged on the substrate (1) successively provided with the reflecting layer (6) from bottom to up. The encapsulation structure is characterized in that LED blue dies are arranged on the substrate (1) in an array mode. The encapsulation method comprises the following steps: embedding the LED blue dies, coating solder paste on high conductivity substrate material, bonding dies through reflow soldering, fixing the LED blue dies on the substrate, and adopting ultrasonic wire bonding technology to connect the LED and a circuit board. The LED blue dies are covered with yellow fluorescent powder and epoxy resin and the reflecting layer is plated on the heat-conducting substrate so that the luminous efficiencyand heat dissipation effect of the LED are increased and the rays are parallel and uniform. The encapsulation method is used to reduce power consumption, increase luminous efficiency, prolong the life of the device and save energy. The volume of the encapsulation structure is reduced and the backplane becomes lighter and thinner.

Description

technical field [0001] The invention relates to a new type of LED backlight packaging technology, especially a kind of LED backlight integrated packaging that can be applied to large-area light sources that need to save energy, lighting sources for shadowless lamps in the medical field, flat panel display fields, and LCD TV backlights. Structure and packaging method. Background technique [0002] The durability, low power consumption, and changeable colors of LEDs have been recognized by the lighting industry. Leveraging on the advantages of LEDs in terms of lower power consumption, more uniform display screen brightness, thinner and more stylish appearance, and more environmentally friendly, LED backlights are currently used in small-sized screens such as mobile phones, digital cameras, and MP4s, as well as portable DVDs and notebooks. , car navigator, medical shadowless lighting and other fields have been widely used. However, in the large-screen size LED backlight, ther...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/58H01L33/64
CPCH01L2224/48091
Inventor 张俊涛陈晓莉张方辉席俭飞
Owner SHAANXI UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com