Method for preparing temperature-resistant type compound bonding agent
A composite adhesive, temperature-resistant technology, used in adhesives and other directions, can solve the problems of high molecular weight, poor wetting and leveling performance, etc., achieve high cross-linking density, save organic diluent solvents, and ensure high temperature resistance. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0025] This embodiment provides a method for preparing a temperature-resistant composite adhesive, which can prepare a high-performance temperature-resistant composite adhesive used in composite flexible packaging film materials. The preparation method includes:
[0026] First prepare polyester polyol, and each raw material in the following steps is calculated by mass percentage;
[0027] a. Esterification reaction:
[0028] Combine 3 to 6% of trimethylolpropane, 20 to 30% of terephthalic acid, 20 to 30% of sebacic acid, 15 to 25% of diethylene glycol, and 15 to 25% of neopentyl Glycol was added to the polyester synthesis kettle, heated to 210-230°C, reacted for 2 to 3 hours to complete the esterification; in the esterification reaction step, keep the water output of the polyester synthesis kettle stable at the total amount of raw materials used in the esterification reaction 0.5-1% / hour of the mass, the water distilled during the esterification process accounts for 6-12% of the tot...
Embodiment 2
[0039] This embodiment provides a method for preparing a temperature-resistant composite adhesive, which can prepare a high-performance temperature-resistant composite adhesive used in composite flexible packaging film materials. The preparation method includes:
[0040] To prepare the adhesive (first prepare the polyester polyol), take the raw materials as follows:
[0041]
[0042] Steps:
[0043] a. Esterification reaction:
[0044] 3.75 parts by mass of trimethylolpropane, 25 parts by mass of terephthalic acid, 22.5 parts by mass of sebacic acid, 18.75 parts by mass of diethylene glycol, and 15 parts by mass of neopentyl glycol were added to the poly In the ester synthesis kettle, heat up to 210-230°C and react for 2.5 hours; during the reaction, pay attention to the water output of the polyester synthesis kettle and keep the water output stable at 0.5-1% per hour based on the total mass of each raw material; distilled water 9.42 parts by mass; after the esterification reaction i...
Embodiment 3
[0052] This embodiment provides a method for preparing a temperature-resistant composite adhesive, which can prepare a high-performance temperature-resistant composite adhesive used in composite flexible packaging film materials. The preparation method includes:
[0053] To prepare the adhesive, take the raw materials as follows:
[0054]
[0055] Steps:
[0056] a. Esterification reaction:
[0057] 5 parts by mass of trimethylolpropane, 21 parts by mass of terephthalic acid, 28 parts by mass of sebacic acid, 18 parts by mass of diethylene glycol, and 18 parts by mass of neopentyl glycol were added to the poly In the ester synthesis kettle, heat up to 210-230°C and react for 3 hours: During the reaction, pay attention to the water output of the polyester synthesis kettle, and keep the water output stable at 0.5-1% of the total mass of the raw materials used in the esterification reaction per hour , Distilled water 9.53 parts by mass; After the esterification reaction is completed, th...
PUM
Property | Measurement | Unit |
---|---|---|
hydroxyl value | aaaaa | aaaaa |
viscosity | aaaaa | aaaaa |
acid value | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com