Method of plasma treatment and plasma treatment apparatus

A plasma and processing method technology, applied in the fields of plasma processing and plasma processing equipment, can solve the problems of in-plane uniformity obstruction, uncontrollable ion density, etc., and achieve uniformity improvement, etching rate uniformity improvement, density Evenly distributed effect
CN101809720AInactive Publication Date: 2010-08-18TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2010-08-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

In the plasma treatment by an electrically negative gas, the in-plane uniformity of plasma treatment is enhanced over the prior art by controlling the ion density in the plasma. Not only is a treating gas being an electrically negative gas introduced from a treating gas source (170) into a treatment chamber (102) but also an electrically negative gas greater in electron attachment coefficient than the treating gas is introduced as an addition gas from an addition gas source (180) to thereby form a plasma. In the plasma formation, the ion density in the plasma is controlled by regulating the flow rate of the addition gas relative to the treating gas.
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Description

Plasma treatment method and plasma treatment apparatus technical field The present invention relates to a plasma processing method and a plasma processing apparatus for performing predetermined plasma processing on a substrate to be processed. Background technique In general, in the manufacturing process of semiconductor devices, film formation, etching, heat treatment, modification, crystallization, etc. Various processes, thereby forming a desired semiconductor integrated circuit. Among the above-mentioned various treatments, for example, in the etching treatment process, a plasma etching treatment method (for example, refer to Patent Document 1) is often used, that is, a predetermined etching gas is used as a processing gas from a shower head disposed on the upper part of the processing chamber. The etching gas is introduced into the processing chamber, and the etching gas is converted into plasma by high-frequency power or the like, and the plasma is applied to the s...

Claims

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