Metal oxide fine particles, silicone resin composition and use thereof

A silicone resin composition, oxide technology, applied in the direction of dyeing organosilicon compound treatment, compound of periodic table group 4/14 elements, organic chemistry, etc. and other problems, to achieve the effects of excellent light transmission performance and heat resistance, inhibition of mutual aggregation, and high solubility

Inactive Publication Date: 2010-09-01
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, silicone resin generally has a low refractive index such as about 1.4, so the difference in refractive index (about 2.5) from the LED element becomes large
Therefore, there is a problem that the total reflected light at the interface between the resin and the element increases, so that the light extraction efficiency decreases

Method used

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  • Metal oxide fine particles, silicone resin composition and use thereof
  • Metal oxide fine particles, silicone resin composition and use thereof
  • Metal oxide fine particles, silicone resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] After diluting 0.81 g of an aqueous dispersion of zirconia (solid concentration: 40% by weight, average particle diameter: 7 nm) with 3 g of ethanol, 0.89 g (3.8 mmol) (based on 100 parts by weight of the metal to be surface-treated) was added thereto. Oxide fine particles, a solution obtained by dissolving 275 parts by weight of 7-octenyl(trimethoxy)silane in 10 g of isopropanol, followed by stirring at room temperature (25° C.) for 20 hours. Then, the solvent was removed by evaporation under reduced pressure to obtain an oil (transparent) containing zirconia particles having a 7-octenylsilyl group bonded to the surface. The average particle diameter of the zirconia particles after surface treatment was 7 nm.

Embodiment 2

[0090] The reaction was carried out in the same manner as in Example 1, except that 0.44 g (2.0 mmol) (136 parts by weight based on 100 parts by weight of the metal oxide fine particles to be surface-treated) of 7-octenyl (trimethoxy base) silane and 0.39 g (2.0 mmol) hexyl (trimethoxy) silane instead of 0.89 g (3.8 mmol) 7-octenyl (trimethoxy) silane used in Example 1, thereby obtaining zirconia particles containing Oil (clear), the zirconia particles have both 7-octenylsilyl and hexylsilyl groups bonded to the surface. The average particle diameter of the zirconia particles after surface treatment was 7 nm.

Embodiment 3

[0092] The reaction was carried out in the same manner as in Example 1, except that 0.81 g of an aqueous dispersion of silica (solid concentration: 40% by weight, average particle diameter: 10 nm) was used instead of the 0.81 g of aqueous zirconia used in Example 1. dispersion, thus obtaining an oil (clear) containing silica particles with 7-octenylsilyl groups bonded to the surface. The average particle diameter of the zirconia particles after the surface treatment was 10 nm. In addition, 7-octenyl(trimethoxy)silane was used in an amount of 275 parts by weight based on 100 parts by weight of the metal oxide fine particles to be surface-treated.

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Abstract

The present invention relates to metal oxide fine particles treated with a surface-treating agent containing a silicon compound having an alkenyl group having 2 to 20 carbon atoms, a silicone resin composition obtained by reacting the metal oxide fine particles with an oxganohydrogensiloxane, a photosemiconductor element-encapsulating material containing the silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the silicone resin composition or the photosemiconductor element-encapsulating material; a silicone resin composition and use thereof.

Description

technical field [0001] The present invention relates to metal oxide fine particles. More specifically, the present invention relates to metal oxide fine particles surface-treated with a specific compound, a silicone resin composition obtained by reacting the metal oxide fine particles, an optical semiconductor element encapsulating material containing the silicone resin composition , and an optical semiconductor device comprising a semiconductor element encapsulated with the silicone resin composition or optical semiconductor element encapsulating material. Background technique [0002] In recent years, light-emitting diodes (LEDs) have attracted attention as a new lighting source that achieves significant energy savings. Because lighting LEDs have very high brightness per chip unlike display LEDs, transparent resins used to package lighting LEDs require excellent light resistance and heat resistance. From such a point of view, for lighting LEDs, silicone resins having hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C3/12C09C1/00C09C1/36C09C1/04C09C1/28C09C1/40C08G77/04C08K9/06C08K3/22H01L33/56
CPCC08G77/70C09C1/3684C07F7/0859C07B2200/11C08G77/18C08G77/20C01P2006/40C08G77/24C08L83/04C07F7/1836C08G77/045C09C1/3692C08G77/14C09C1/309C09C1/3081C01P2004/64C09C3/12C09C3/006C01P2006/60B82Y30/00C07F7/0838C07F7/1804
Inventor 藤井春华尾崎孝志片山博之
Owner NITTO DENKO CORP
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