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Method for vacuum liquating, crystallizing, separating and recycling lead and zinc in metal of waste circuit board

A waste circuit board, separation and recovery technology, which is applied in the field of separation and recovery of lead and zinc in waste circuit board metal by vacuum crystallization technology, can solve the problems of secondary pollution, large chemical reagents, consumption, etc., and achieve efficient separation, recovery, and operation methods. The effect of simplicity, cost and environmental benefits

Inactive Publication Date: 2010-09-08
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above methods can realize the separation and recovery of metal mixtures, they consume a large amount of chemical reagents and generate a large amount of waste liquid, causing secondary pollution.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Put 20 g of waste circuit board mixed metal (the mass fraction of lead is 5%, and the mass fraction of zinc is 2.5%) into a quartz crucible, and then put the crucible into the heating chamber of the main evaporation chamber of the vacuum melting crystallization furnace. Open the door before closing the main evaporation chamber, start the vacuum system to evacuate the vacuum melting crystallization furnace, so that the pressure in the furnace chamber reaches 8.0×10 -4 Pa. Heat the first-stage collection chamber and the second-stage collection chamber to 800°C and 500°C respectively. After the temperature of the two collection chambers is relatively stable, heat the main evaporation chamber to 900°C and keep the temperature constant for 1 hour. After stopping the heating, the vacuum melting crystallization furnace was cooled to room temperature, and the pressure was restored to normal pressure. Take out the crucible and collection chamber quartz glass tube. 18.51g of re...

Embodiment 2

[0019] Put 20 g of waste circuit board mixed metal (the mass fraction of lead is 5%, and the mass fraction of zinc is 2.5%) into a quartz crucible, and then put the crucible into the heating chamber of the main evaporation chamber of the vacuum melting crystallization furnace. Open the door before closing the main evaporation chamber, start the vacuum system to evacuate the vacuum melting crystallization furnace, so that the pressure in the furnace chamber reaches 8.8×10 -3 Pa. Heat the first-stage collection chamber and the second-stage collection chamber to 600°C and 400°C respectively. After the temperature of the two collection chambers is relatively stable, heat the main evaporation chamber to 900°C and keep the temperature constant for 1 hour. After stopping the heating, the vacuum melting crystallization furnace was cooled to room temperature, and the pressure was restored to normal pressure. Take out the crucible and collection chamber quartz glass tube. 18.53g of re...

Embodiment 3

[0021] Put 20 g of waste circuit board mixed metal (the mass fraction of lead is 5%, and the mass fraction of zinc is 2.5%) into a quartz crucible, and then put the crucible into the heating chamber of the main evaporation chamber of the vacuum melting crystallization furnace. Open the door before closing the main evaporation chamber, start the vacuum system to evacuate the vacuum melting crystallization furnace, and make the pressure in the furnace chamber reach 5.0×10 -2 Pa. Heat the first-stage collection chamber and the second-stage collection chamber to 700°C and 300°C respectively. After the temperature of the two collection chambers is relatively stable, heat the main evaporation chamber to 900°C and keep the temperature constant for 2.5 hours. After stopping the heating, the vacuum melting crystallization furnace was cooled to room temperature, and the pressure was restored to normal pressure. Take out the crucible and collection chamber quartz glass tube. 18.55g of ...

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PUM

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Abstract

The invention relates to a method for separating and recycling lead and zinc in metal of a waste circuit board by utilizing vacuum liquation crystallization technology under the segmental heating condition. Mixed metal of a waste circuit board is arranged inside a heating chamber of a main evaporation chamber, a vacuum system is started, the main evaporation chamber is heated and maintained at a constant temperature after a collection chamber system is heated until the temperature is stable, during the process, metal lead and zinc are gasified and are respectively precipitated inside a first section and a second section collection chambers, and the metal lead and zinc are separated. By utilizing the segmental heating vacuum liquation crystallization method, the separation and recycling of lead and zinc in the metal of the waste circuit board can be realized in an environmental-friendly, economical and high-efficient way, the operation method is simple, convenient and easy, and vast advantage on the aspects such as the cost and the environmental protection can be realized.

Description

technical field [0001] The invention relates to the separation and recovery of lead and zinc in waste circuit board metal, in particular to a method for separating and recovering lead and zinc in waste and old circuit board metal by using vacuum melting and crystallization technology under the condition of segmental heating. Background technique [0002] With the rapid development of the information industry, the production scale and application scope of circuit boards are constantly expanding, and the update speed of information equipment is gradually accelerating, resulting in a large amount of electronic waste, and the number of waste circuit boards is also increasing year by year. The metal content in printed circuit boards is very high, much higher than the mineral metal content that exists in nature. According to literature reports, it contains 20% copper, 8% iron, 2% nickel, 4% tin, 2% lead, and 2% aluminum , 1% zinc, 0.4% antimony, and a small amount of precious meta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B13/10C22B19/04
Inventor 高郁杰丁辉李鑫钢王哲
Owner TIANJIN UNIV
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