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Heat radiator with composite structure and preparation method thereof

A composite structure and heat sink technology, applied in heat exchange equipment, lighting and heating equipment, electric solid devices, etc., can solve problems such as increased production costs, decreased directional thermal conductivity, and suboptimal heat dissipation efficiency

Active Publication Date: 2011-09-28
湖北联投恒达石墨有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem of small heat capacity of the fin material is not solved, and the heat dissipation efficiency is not optimal.
Moreover, although the thermal conductivity of the heat sink is changed from two-dimensional to three-dimensional by crushing, impregnating and graphitizing methods, it is inevitable that the directional thermal conductivity decreases, and the time required for graphitization by heating in the final step of preparation About 1 month, increasing production cost

Method used

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  • Heat radiator with composite structure and preparation method thereof
  • Heat radiator with composite structure and preparation method thereof
  • Heat radiator with composite structure and preparation method thereof

Examples

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Effect test

preparation example Construction

[0035] A method for preparing a graphite radiator with a composite structure includes the following steps:

[0036] 1) The expandable graphite is impregnated with paraffin wax in a vacuum impregnation box, the paraffin immersion amount is 85% ± 5% of the total weight of the finished product, and multiple long fins 1 are formed after compaction;

[0037] 2) The density is 1.1-1.7g / cm 3 The flexible graphite board is made of a thermal conductive layer 7 and multiple short fins 2;

[0038] 3) Multiple long fins 1 and multiple short fins 2 are arranged staggered, one end is aligned, and the clamping device is used to install firmly. Except for the aligned end faces, the other three end faces are edge-sealed with PET single-sided adhesive film;

[0039] 4) Polish the aligned end face, and install the thermal conductive layer 7 on the end face.

[0040] The said flexible graphite board adopts 0.2-0.3g / cm 3 Then dissolve the thermosetting phenolic resin with anhydrous ethanol to form a thermos...

Embodiment 1

[0045] Use 50 mesh flake graphite, use concentrated sulfuric acid and nitric acid according to a certain ratio to carry out oxidation intercalation reaction, wash and dry to obtain expandable graphite, expandable graphite is expanded at 850 ℃, the expansion ratio is 200 times, the expanded graphite is pressed into density 0.2g / cm 3 The plate thickness is 3mm. According to the size of the impregnation box, the sheet size is designed to be 500x500mm.

[0046] Use paraffin wax as the energy storage phase change material, the phase change temperature is 58℃, the phase change heat is 190KJ / kg, the phase change paraffin is melted in the container, and the vacuum impregnation box is used to suck into the low-density expanded graphite In the vacuum box of the board, the temperature in the vacuum box is kept at 65°C, and the vacuum degree of the vacuum box equipped with the graphite board is maintained at -0.095MPa before the paraffin is sucked.

[0047] After the graphite plate is immerse...

Embodiment 2

[0059] The manufacturing method of the expanded graphite and paraffin composite board is the same as in Example 1.

[0060] Produce 0.2g / cm according to Example 1 3 Then dissolve the thermosetting phenolic resin with absolute ethanol into a solution with a concentration of 20%. Use the vacuum impregnation method to impregnate the graphite plate with thermosetting phenolic resin. After the impregnated graphite plate is dried, use a plastic crusher Crush, then use a stirring mill to pulverize into 80 mesh powder, hot press molding to 1.7g / cm 3 The density and thickness of graphite plates are 2mm and 0.18mm. The high-strength flexible graphite plates are processed into parts with mounting holes with a blade die. The part size is 50x50mm. The graphite sheet is cured at a temperature of 175°C to obtain a high-strength flexible graphite sheet. The high-strength flexible graphite board has a thermal conductivity of 500W / mK in the surface direction. The thermal conductivity in the plane...

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Abstract

The invention discloses a heat radiator with a composite structure, which relates to the field of electronic products heat radiators. A plurality of long fins made from expandable graphite composite materials and a plurality of short fins made from flexible graphite materials are staggered in a clamping device, wherein the long fins align with one ends of the short fins, the aligned end face is provided with a heat-conducting layer which is made of flexible graphite material or metal materials and has the thickness of 0.15-0.2 mm. The invention fully takes the advantage of the high heat conductivity of the flexible graphite plate material in the plane direction, optimizes a heat-conducting structure when the high heat conductivity of the flexible graphite plate material and the high heat-tolerance performance of the expandable graphite composite material are matched, forms a favorable three-dimensional heat dissipation effect and has light weight, little heat resistance, favorable contact, controllable temperature, short production cycle and low production cost. The invention also relates to a preparation method of the heat radiator.

Description

Technical field [0001] The invention relates to the field of radiators for electronic products, in particular to a graphite radiator with a composite structure suitable for heat dissipation of integrated circuit chips and a preparation method thereof. Background technique [0002] At present, the rapid development of integrated circuit technology has caused various electronic devices and products to become smaller and smaller, and the heat flux density around integrated devices is increasing. Taking a computer CPU as an example, the heat flux density generated during its operation has reached 60 -100W / cm 2 , Even up to 103 W / cm in semiconductor lasers 2 Magnitude. On the other hand, the working reliability of electronic devices is very sensitive to temperature. Every time the device temperature increases by 1°C above the level of 70-80°C, the reliability will drop by 5%. Higher temperature levels have increasingly become a bottleneck restricting the performance of electronic dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F3/02H01L23/373
CPCF28F21/02F28F3/02
Inventor 傅云峰李云峰王凤军
Owner 湖北联投恒达石墨有限公司
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