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Black halogen-free epoxy resin composition and covering film prepared from same

A halogenated epoxy resin and epoxy resin technology, which is applied in the field of black halogen-free epoxy resin composition and the cover film prepared by using the same, can solve the problems of immature price and high cost, and achieve excellent dimensional stability and good mechanical properties. Performance, effect of high peel strength

Inactive Publication Date: 2010-10-06
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But there is a problem. Black PI films with a thickness of more than 25 μm are sold both at home and abroad, while 12.5 μm is only produced by DuPont (brand name Kapton-CB), and is hardly sold to the outside world. At present, some manufacturers are actively developing black with this specification. PI film, but they are not mature enough and expensive, and customers often need a black cover film of 12.5 μm PI film, so they have to adopt the second technical approach

Method used

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  • Black halogen-free epoxy resin composition and covering film prepared from same
  • Black halogen-free epoxy resin composition and covering film prepared from same

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preparation example Construction

[0049] The composition described above can be used in the preparation of a cover film. The desired components are mixed using an organic solvent to form a black liquid dispersion of the composition of the present invention, and the dispersion is coated onto a polyimide insulating film using a coating device. The insulating film coated with the dispersion is passed through an online drying oven, heated at 80-160° C. for 2 to 8 minutes, thereby removing the organic solvent and drying the composition to form a layer containing the composition in a semi-cured state, followed by Laminate with release paper at 80-100°C, and roll to get a black cover film.

[0050] The dry thickness of the coating film of the composition in the above cover film is 5-45 μm, preferably 10-35 μm.

[0051] The thickness of the polyimide insulating film used above is 10-100 μm, the thickness of the release paper is 50-150 μm, and the thickness of the glue is 10-35 μm.

[0052] The color and light transm...

Embodiment 1

[0055] Epoxy resin (product model NC-3000-H, epoxy equivalent 290 g / eq, manufactured by Nippon Kayaku) 35 parts by weight; carboxyl-terminated nitrile rubber (product model Nipol 1072CG, acrylonitrile content 27% by mass, manufactured by Zeon Corporation) 21 parts by weight; 9.1 parts by weight of acrylate-modified epoxy resin (product model BPF307, elastomer content 20% by mass, manufactured by Nippon Shokubai Co., Ltd.); 6.63 parts by weight of diaminodiphenyl sulfone (DDS); 1-cyanoethyl -0.163 parts by weight of 2-ethyl-4-methylimidazole (2E4MZ-CN); 1.95 parts by weight of carbon black powder (commodity model HI-Black 50L, manufactured by Korea KCB); titanium dioxide (commercial model R-706, manufactured by DuPont) 6.5 parts by weight; phosphorus-containing flame retardant (product model OP-935, manufactured by Clariant, Germany) 13 parts by weight; antioxidant (product model 1010, manufactured by CIBA GEIGY Co.) 0.05 parts by weight. A butanone solvent was used to adjust t...

Embodiment 2

[0056] Example 2: The solids content of the benchmark formula is calculated as 100 parts by weight, except for carbon black powder and titanium dioxide, other components are added in the same proportion. Add 4.0 parts of carbon black powder and 5.0 parts of titanium dioxide.

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Abstract

The invention relates to a black halogen-free epoxy resin composition and a covering film prepared from the same. The black halogen-free epoxy resin composition comprises epoxy resin, CTBR (Carboxyl Terminated Butadiene Rubber), acrylic ester modified epoxy resin, a curing agent, a curing accelerator, carbon black powder, titanium dioxide, a phosphorus flame retardant, inorganic fillers and an organic solvent. The covering film prepared from the composition comprises a polyimide insulated film, a black halogen-free epoxy resin composition coating coated on the polyimide insulated film and release paper covered on the black halogen-free epoxy resin composition coating. The resin composition does not contain halogens, is black by adopting less carbon black powder to play the shading effect and adopts titanium dioxide to enhance the shading effect. Meanwhile, the acrylic ester modified epoxy resin is used so that a resin system reaches fire retardance and keeps favorable mechanical performance. The covering film prepared from the composition reaches the standards of surface resistance and volume resistivity, reaches a flame retardance level of UL 94 V-0 and has high peeling strength and excellent size stability, flexibility and processing performance.

Description

technical field [0001] The invention relates to a halogen-free epoxy resin composition, in particular to a black halogen-free epoxy resin composition and a covering film prepared by using the same. Background technique [0002] The cover film for flexible printed circuit (FPCB) not only acts as a solder mask, but also protects FPCB from dust, moisture, and chemicals, and reduces the stress during bending. The cover film is coated with a layer of adhesive on the polyimide (PI) film, then baked to remove the solvent, and then compounded with the release paper. Commonly used adhesives include epoxy resin, acrylate, polyester, etc., such as JP-A-2004-137437, WO2008 / 136096, CN 1847352A, CN 1670107A, etc. Among them, there are mainly two types of acrylate and epoxy resin. , both have their advantages and disadvantages. The acrylate-based cover film has a long storage period and good adhesion, but its heat resistance is poor; the epoxy resin system has excellent heat resistance, b...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L13/00C08L9/02C08L63/10C08K13/02C08K3/04C08K3/22B32B27/08B32B27/10
Inventor 刘生鹏茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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