Black halogen-free epoxy resin composition and covering film prepared from same
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- GUANGDONG SHENGYI SCI TECH
- Publication Date
- 2010-10-06
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a halogen-free epoxy resin composition, in particular to a black halogen-free epoxy resin composition and a covering film prepared by using the same. Background technique
[0002] The cover film for flexible printed circuit (FPCB) not only acts as a solder mask, but also protects FPCB from dust, moisture, and chemicals, and reduces the stress during bending. The cover film is coated with a layer of adhesive on the polyimide (PI) film, then baked to remove the solvent, and then compounded with the release paper. Commonly used adhesives include epoxy resin, acrylate, polyester, etc., such as JP-A-2004-137437, WO2008 / 136096, CN 1847352A, CN 1670107A, etc. Among them, there are mainly two types of acrylate and epoxy resin. , both have their advantages and disadvantages. The acrylate-based cover film has a long storage period and good adhesion, but its heat resistance is poor; the epoxy resin system has excellent heat resistance, b...