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Epoxy resin composition as well as bonding sheet and copper-clad plate made from same

A technology of epoxy resin and composition, applied in the direction of online phenolic epoxy resin adhesive, epoxy resin glue, synthetic resin layered products, etc., can solve the problem of difficult to reduce production cost, difficult to reduce material cost, copper clad laminate Poor heat resistance and other problems, to achieve the effect of enhancing heat resistance polarity, improving heat resistance, and high heat resistance

Inactive Publication Date: 2010-11-10
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, in the existing production cost composition of copper clad laminates, the cost of most materials is difficult to reduce, and it is difficult to achieve the purpose of reducing production costs
[0004] At present, the curing agents used in FR-4 copper clad laminates mainly include dicyandiamide (DICY), 4,4-diaminodiphenyl sulfone (DDS), phenolic resin, etc., and DICY is used alone as the curing agent, and the heat resistance of copper clad laminates is poor.
The use of phenolic resin can greatly improve the heat resistance of copper clad laminates, but the interlayer bonding performance will decrease

Method used

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  • Epoxy resin composition as well as bonding sheet and copper-clad plate made from same
  • Epoxy resin composition as well as bonding sheet and copper-clad plate made from same
  • Epoxy resin composition as well as bonding sheet and copper-clad plate made from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] First, 1.86 parts of dicyandiamide (DICY) were dissolved in DMF, 20 parts of KEC-2180 o-cresol novolac epoxy resin were dissolved in DMF and butanone solvent, and 0.04 parts of 2-MI were dissolved in butanone. Then the above three solutions that have been dissolved are mixed with 73 parts of DER530A80 bromine flame-retardant epoxy resin, 3.5 parts of 1031 epoxy resin with UV light blocking function, and 1.6 parts of ETHACURE200 diethyltoluenediamine, supplemented with DMF and MEK Stir uniformly to form a glue solution; the solid resin content in the prepared glue solution is 55-70%, and the gelation time is 200s to 350s. Immerse the glass fiber cloth in the above resin composition glue, put the impregnated glass fiber cloth into the oven and bake. This step is applicable to the gluing mode of FR-4, and the baking temperature is required to be higher than that of FR-4. Bake in an oven at 155°C for 6 minutes, and make an adhesive sheet after semi-curing. Eight bonding sh...

Embodiment 2

[0036] First, 20 parts of EPON164 o-cresol novolac epoxy resin were dissolved in DMF and butanone solvent, and 0.004 parts of 2-MI were dissolved in butanone. Then the above two solutions that have been dissolved are mixed with 64 parts of DER530A80 bromine flame-retardant epoxy resin, 4 parts of 1031 epoxy resin with UV light blocking function, and 12 parts of ETHACURE200 diethyltoluenediamine, supplemented with DMF and MEK Stir uniformly to form a glue solution; the solid resin content in the prepared glue solution is 55-70%, and the gelation time is 200s to 350s. Immerse the glass fiber cloth in the above resin composition glue, put the impregnated glass fiber cloth into the oven and bake. This step is applicable to the gluing mode of FR-4, and the baking temperature is required to be higher than that of FR-4. Bake in an oven at 155°C for 6 minutes, and make an adhesive sheet after semi-curing. Eight bonding sheets prepared above were bonded and stacked together, and coppe...

Embodiment 3

[0038]First, dissolve 20 parts of KEC-2180 o-cresol novolac epoxy resin with butanone solvent, dissolve 0.03 parts of 2-MI with butanone, and dissolve 0.06 parts of boron trifluoride monoethylamine with butanone solvent . Then dissolve the above three solutions together with 43 parts of DER530A80 bromine flame retardant epoxy resin, 7 parts of 1031 epoxy resin with UV light blocking function, 2 parts of DDS, 3 parts of ETHACURE200 diethyltoluenediamine, 25 parts Parts of phenolic resin are mixed, supplemented with PM and MEK and stirred evenly to form a glue; the solid resin content in the prepared glue is 55-70%, and the gelation time is 200s to 350s. Immerse the glass fiber cloth in the above resin composition glue, put the impregnated glass fiber cloth into the oven and bake. This step is applicable to the gluing mode of FR-4, and the baking temperature is required to be higher than that of FR-4. Bake in an oven at 155°C for 6 minutes, and make an adhesive sheet after semi...

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Abstract

The invention relates to an epoxy resin composition as well as a bonding sheet and a copper-clad plate made from the same. The epoxy resin composition comprises bromine flame-retardant epoxy resin, a curing agent, an imidazole curing accelerating agent and a solvent, wherein the curing agent at least contains diethylmethylbenzenediamine. The bonding sheet made from the resin composition comprises a reinforcing material and a matrix soaked on the reinforcing material, the matrix is the epoxy resin composition. The copper-cladding foil laminating plate made from the resin composition comprises a laminating plate and a copper foil laminated on one side or two sides of the laminating plate, the laminating plate comprises a plurality of mutually bonded bonding sheets, and the bonding sheet is manufactured by adopting the epoxy resin composition. The epoxy resin composition manufactured by adopting o-cresol epoxy resin can effectively improve the heat-resisting property of the product; the compound curing agent containing the diethylmethylbenzenediamine as a liquid amine epoxy resin curing agent is adopted to further strengthen the heat resistance; and the bonding sheet and the copper-cladding plate made from the epoxy resin composition have high heat resistance and are suitable for lead-free solder welding.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition containing a liquid amine epoxy resin curing agent and an adhesive sheet and a copper clad board made by using the epoxy resin composition. Background technique [0002] Since the 1990s, the world's electronic information industry, represented by electronic computers and mobile phones, has developed rapidly. The total amount of electronic products in the world has been increasing at a rate of about 13% per year. The electronic industry has become the largest industry in the world today. . [0003] On July 1, 2006, the official implementation of the two directives issued by the European Union ("Directive on Prohibiting the Use of Certain Hazardous Substances in Electrical and Electronic Products" and "Directive on Waste Electrical and Electronic Products") marked that the global electronics industry will enter the The era of lead-free soldering. Due to the...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/04C08G59/50C09J7/02C09J7/04C09J163/00C09J163/04B32B15/092B32B27/04
Inventor 唐国坊杨中强
Owner GUANGDONG SHENGYI SCI TECH
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