Plastic lead frame structure with reflective and conductor metal layer and preparation method thereof

Abstract

The invention provides a plastic lead frame structure with a reflective and conductor metal layer and a preparation method thereof. The method comprises the following steps of: injecting to form a base made of a metal catalyst-containing plastic or an organic matter-containing plastic, wherein a staggered and connected carrier embedded groove is formed at the periphery of the base; forming a carrier which does not contain a metal catalyst plastic or organic matter plastic by using the double-injection technology; inclining downwards from the top of the base to form an accommodating space for accommodating a light-emitting diode; depositing an interfacial layer electroless copper or a nickel plating layer on the surface of the base, and stripping partial interfacial layer so as to form an insulating line by using the laser technology to make the insulating line connected with the carrier; and electroplating or chemically depositing copper, nickel, silver or gold, and other metal layersto form the plastic lead frame structure with the reflective and conductor metal layer.

Description

technical field [0001] The invention relates to a lead frame preparation technology for light-emitting diodes, specifically a plastic lead frame structure with a reflective and conductive metal layer, so as to simplify the manufacturing process, reduce costs, and further improve its reflection efficiency and increase Conductor area to form a leadframe structure with high thermal conductivity. Background technique [0002] Existing light-emitting diode lead frames are generally made of conductive materials (such as: copper, copper alloy or aluminum, etc.), which are punched to form the blanks of the lead frame, and then electroplated to form a blank on the surface of the lead frame blank. Plating a layer of metal layer with high conductivity (such as tin, silver, gold, etc.), and then using Insert Molding technology (Insert Molding) to form a cup-shaped light-emitting diode lead frame, but the reflection of the cup-shaped lead frame Areas cannot effectively provide the refle...

AI Technical Summary

Problems solved by technology

These two methods are limited in the processing of extremely fine lines due to the double injection process, and cannot effectively form extremely fine lines

[0006] In other words, the existing light-emitting diode lead frame cannot reduce its production cost due to the complicated manufacturing process, or because the surface is rough after laser activation, which makes it impossible to achieve the originally designed reflection angle and reflection brightness, thereby affecting its reflection efficiency. , and cannot be applied to micronized insulating circuit patterns, so how to provide a lead frame with the characteristics of easy fabrication, low cost and high reflectivity is an urgent task in the industry at present

[0007] Therefore, the inventor of the present invention has made in-depth discussions on the problems of the aforementioned existing lead frames, and actively sought solutions through years of research and development and manufacturing experience in related industries. After continuous efforts in research and trial production, he finally successfully developed a reflective And the plastic lead frame structure of the conductor metal layer and its preparation method, to solve the inconvenience and troubles caused by the complex manufacturing process of the existing lead frame, reflection efficiency, heat conduction, and electric conduction.

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