Preparation method for solar silicon wafer linear cutting mortar

A technology of solar silicon wafers and production methods, applied in the direction of base materials, additives, petroleum industry, etc., can solve the problems of many types of cutting fluids, instability, and many batches, and achieve high cutting rate of good products and good redispersion ability , Strong cutting ability

Active Publication Date: 2010-12-29
上海甲冠半导体科技有限公司
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AI Technical Summary

Problems solved by technology

The main problem is that there are many types of cutting fluid in the market, and the quality is unstable. The small amount of manual sand preparation each time results in many batches, and the human factor has a great influence
The high cost of production management and warehousing has resulte

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1 Preparation of 1646kg wire cutting mortar

[0020] Weigh 1100 kg of polyethylene glycol 200, 18 kg of nano film-forming agent, 0.8 kg of dispersant, 0.5 kg of surfactant, 0.5 kg of defoamer, 0.2 kg of metal corrosion inhibitor, and 500 kg of silicon carbide particles.

[0021] a. Slowly add 18 kilograms of nanometer film-forming agents into 1100 kilograms of polyethylene glycol 200, and add while stirring for 20 minutes;

[0022] b. Slowly add 0.8 kg of dispersant to polyethylene glycol 200 dropwise, and then add 500 kg of silicon carbide microparticles to 1100 kg of polyethylene glycol 200 in time and in stages with a special device after continuous stirring for 30 minutes.

[0023] c. At the same time, 0.5 kg of surfactant and 0.5 kg of defoamer are divided into multiple pipelines and added dropwise at the speed of adding silicon carbide in 3 hours.

[0024] d. Finally, add 0.2 kg of metal corrosion inhibitor dropwise into the mortar and stir for 2 hour...

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Abstract

The invention provides a novel production method for solar silicon wafer linear cutting mortar. In the production of the cutting mortar, additives (a, polyethylene glycol, b, microparticles (silicon carbide, cerium oxide and abrasive powder), c, a dispersant, d, a surfactant, e, defoamer, f, metal corrosion inhibitor, and g, a nano film molding agent) with different functions and for different purposes are processed into cutting or polishing mortar by a specific processing mode of adding and synthesizing at different time and in different steps. The method can improve the stability, suspension property and re-dispersion capability of the silicon carbide microparticles in the polyethylene glycol or water, improve cutting efficiency and guarantee the long-time stability of the water cutting process at the same time, improves the rate of high-quality products and reduces the comprehensive cutting cost; therefore the solar silicon wafer linear cutting mortar is economical and high-return-rate silicon wafer linear cutting mortar.

Description

technical field [0001] The invention relates to a method for making a wire-cut mortar for solar silicon wafers. Background technique [0002] China's photovoltaic power generation industry has ushered in a new stage of rapid development in the past five years. Driven by the "Little Sun Project" and LED industry development and lighting projects, as well as the world's photovoltaic market, my country's photovoltaic power generation industry has developed rapidly. Solar silicon wafer cutting equipment has been put into operation several times and dozens of times in the past three years. Among them, the demand for cutting mortar has reached about 500---800 tons per day. [0003] Using silicon carbide powder as the medium in the wire cutting process of solar silicon wafers, the whole mechanism is to use the hard characteristics and sharp water chestnut of silicon carbide particles to gradually cut off the silicon rods, so the main characteristic of the cutting mortar is good f...

Claims

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Application Information

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IPC IPC(8): C10M169/04C10M107/32C10M143/10C10M177/00
Inventor 周荣华盛忠龚波一
Owner 上海甲冠半导体科技有限公司
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