Preparation method for solar silicon wafer linear cutting mortar

Abstract

The invention provides a novel production method for solar silicon wafer linear cutting mortar. In the production of the cutting mortar, additives (a, polyethylene glycol, b, microparticles (silicon carbide, cerium oxide and abrasive powder), c, a dispersant, d, a surfactant, e, defoamer, f, metal corrosion inhibitor, and g, a nano film molding agent) with different functions and for different purposes are processed into cutting or polishing mortar by a specific processing mode of adding and synthesizing at different time and in different steps. The method can improve the stability, suspension property and re-dispersion capability of the silicon carbide microparticles in the polyethylene glycol or water, improve cutting efficiency and guarantee the long-time stability of the water cutting process at the same time, improves the rate of high-quality products and reduces the comprehensive cutting cost; therefore the solar silicon wafer linear cutting mortar is economical and high-return-rate silicon wafer linear cutting mortar.

Description

technical field [0001] The invention relates to a method for making a wire-cut mortar for solar silicon wafers. Background technique [0002] China's photovoltaic power generation industry has ushered in a new stage of rapid development in the past five years. Driven by the "Little Sun Project" and LED industry development and lighting projects, as well as the world's photovoltaic market, my country's photovoltaic power generation industry has developed rapidly. Solar silicon wafer cutting equipment has been put into operation several times and dozens of times in the past three years. Among them, the demand for cutting mortar has reached about 500---800 tons per day. [0003] Using silicon carbide powder as the medium in the wire cutting process of solar silicon wafers, the whole mechanism is to use the hard characteristics and sharp water chestnut of silicon carbide particles to gradually cut off the silicon rods, so the main characteristic of the cutting mortar is good f...

AI Technical Summary

Problems solved by technology

The main problem is that there are many types of cutting fluid in the market, and the quality is unstable. The small amount of manual sand preparation each time results in many batches, and the human factor has a great influence

The high cost of production management and warehousing has resulted in the disadvantages of weak cutting ability and instability of the slicer table. However, in order to meet the needs of future market development and reduce application costs, the entire industry is doing to improve the quality of silicon wafers and reduce cutting costs. Unremitting efforts