Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate

A FR-4, surface treatment technology, applied in metal material coating process, secondary treatment of printed circuit, improvement of metal adhesion of insulating substrate, etc., can solve the problem of inability to meet environmental protection color requirements and large difference in internal performance of copper foil and other problems, to achieve excellent anti-plating diffusion performance, excellent resistance to normal temperature, improved appearance characteristics and corrosion resistance

Active Publication Date: 2011-01-05
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the copper foil manufacturers in China are still far behind foreign copper foils in terms of internal performance of c

Method used

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  • Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate
  • Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate
  • Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] Example 1

[0033] The surface treatment process of reddish copper foil for high-grade FR-4 copper clad laminates, the specific steps are as follows:

[0034] 1. Roughening: mix and dissolve the cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, then add additive A, and after mixing, use a pump to drive into the roughening tank for electroplating; where Cu 2+ 10g / L, H 2 SO 4 80g / L, the additive A uses gum arabic, the concentration is 8.5ppm, the temperature is 25℃, and the current density is 20A / dm 2 .

[0035] 2. Curing: mix and dissolve the cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate solution, which is pumped into the curing tank for electroplating; where Cu 2+ 50g / L, H 2 SO 4 80g / L, temperature is 35℃, current density is 20A / dm 2 .

[0036] 3. Copper-nitrogen alloy: mix and dissolve the cathode copper, concentrated sulfuric acid, soft water, and steam to form a copper sulfate s...

Example Embodiment

[0041] Example 2

[0042] The difference between this embodiment and embodiment 1 is

[0043] 1. Coarse: Cu 2+ 30g / L, H 2 SO 4 200g / L, temperature is 50℃, current density is 35A / dm 2 , Additive A uses hydroxyethyl cellulose with a concentration of 5.4ppm.

[0044] 2. Curing: Cu 2+ 100g / L, H 2 SO 4 200g / L, temperature is 55℃, current density is 35A / dm 2 .

[0045] 3. Copper-nitrogen alloy: Cu 2+ 20g / L, H 2 SO 4 200g / L, temperature is 50℃, current density is 20A / dm 2 , Additive T is 500ppm, and additive T is acridine orange.

[0046] 4. Galvanized: K 4 P 2 O 7 300g / L, Zn 2+ 10g / L, PH 11, temperature of 50℃, current density of 1.5A / dm 2 , Additive M is tartaric acid with a concentration of 2.3g / L.

[0047] 5. Passivation: potassium chromate 10g / L, PH 12, temperature 50℃, current density 8.0A / dm 2 .

[0048] 6. Spraying coupling agent: 5% concentration of silane coupling agent by volume, temperature 40℃.

Example Embodiment

[0049] Example 3

[0050] The difference between this embodiment and embodiment 1 is

[0051] 1. Coarse: Cu 2+ 20g / L, H 2 SO 4 140g / L, temperature of 40℃, current density of 30A / dm 2 , Additive A is selected propylene thiourea with a concentration of 2.0 ppm.

[0052] 2. Curing: Cu 2+ 75g / L, H 2 SO 4 140g / L, temperature of 45℃, current density of 27A / dm 2 .

[0053] 3. Copper-nitrogen alloy: Cu 2+ 13g / L, H 2 SO 4 140g / L, temperature of 40℃, current density of 11A / dm 2 , Additive T 255PPM, additive T is a mixture of phenazine and 5-hydroxymethylpyrimidine in a mass ratio of 2:1.

[0054] 4. Galvanized: K 4 P 2 O 7 220g / L, Zn 2+ 6g / L, PH 10, temperature of 35℃, current density of 1A / dm 2 , Additive M is sodium dihydrogen phosphate with a concentration of 8.2g / L.

[0055] 5. Passivation: Potassium chromate 6g / L, PH 10, temperature 40℃, current density 5.0A / dm 2 .

[0056] 6. Spray coupling agent: silane coupling agent volume percentage concentration is 2.5%, temperature is 30℃.

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Abstract

The invention relates to a surface treatment process of reddened copper foil for a high-grade FR-4 copper-clad plate, belonging to the field of a copper foil production process. The surface treatment process of the reddened copper foil for the high-grade FR-4 copper-clad plate is characterized by comprising the following steps: taking 12-70mu m high-temperature high-extensibility copper foil as a cathode, operating at a rate of 25.0+/-0.1m/min, carrying out coarsening and solidifying fractal electro-deposition of tuberculiform metallic copper on the surface of the copper foil; electrodepositing a nano-level copper alloy layer, wherein the copper alloy can be observed that the crystal is in a punctiform shape by utilizing an electron scanning microscope, and the crystal belongs to whisker; and electrodepositing a nano-level zinc layer; and finally carrying out alkaline chromating, and coating a layer of silane coupling agent. In the process of electrodepositing a nano-level punctiform whisker copper-nitrogen alloy layer, the invention adopts nitrogen-containing heterocyclic ring organic addition agent to improve the appearance characteristic and the corrosion resistance after surface treatment. The reddened copper foil in the invention has the advantages of favorable normal temperature resistance, high-temperature oxydation performance, plating diffusion resistance, corrosion and etching resistance, favorable peeling resistance and high-temperature conversion resistance.

Description

technical field [0001] The invention relates to a surface treatment process of reddish copper foil for high-grade FR-4 copper-clad laminates, and belongs to the technical field of production process of high-precision electronic copper foil. Background technique [0002] Electronic copper foil is one of the main basic materials of printed circuit boards and is widely used in electrical products. my country is a big producer of electronic copper foil, but there is still a big gap in production technology compared with developed countries, especially high-end products have been occupied by Japan and the United States. In the field of electronic copper foil for high-grade FR-4 copper-clad laminates, in addition to requiring copper foil to have excellent intrinsic properties and environmental friendliness, manufacturers of high-grade copper-clad laminates have also formed an inherent color requirement. At present, most of the copper foil manufacturers in China are still far behi...

Claims

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Application Information

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IPC IPC(8): C23C28/00C25D5/10C25D5/34C25D5/48C25D7/06H05K3/38
Inventor 徐树民刘建广杨祥魁马学武宋召霞
Owner SHANDONG JINBAO ELECTRONICS
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